When I installed mine I got 2/3rd of the way through screwing the backplate back on when I noticed a slight bulge in the middle of it near the inlet/outlet block that wouldn't go down. I took everything back apart and found it was that the RGB connector or cable being pinched between the layers somehow. I adjusted it and everything went back together perfectly.
 
Might not be your issue but I'd check and make sure that's not happening to you.
 
BTW: My temps have been fantastic on this thing, 29C idle, 45-49C underload with +140 core, +600 mem.

Success! I had to re-engineer some things but I'm getting great temps now.
I tried removing the GPU bracket and laying the block on the card and gave a gentle yet firm press. Lifted the block up and there was better TIM transfer but still not 100%.
 
I then removed all of the thermal pads, laid the block back down and had a complete TIM transfer.
 
I then retried the above process but with the GPU bracket installed with the black side facing up and the pegs going into the holes. Still had a great TIM transfer.
 
I then placed all of the thermal pads down EXCEPT the 3 memory strip pads. Once again, a great TIM transfer.
 
I grabbed some 1mm thick thermal pads from my old EK block and placed these memory chip sized 1mm pads on each of the memory chips. There was great TIM transfer.
 
I then proceeded to screw everything back up, filled up my loop and fired up BFV.
 
After 45 mins of 4K Ultra settings in BFV, I have not seen more than 43 C on the GPU Temp1 and no more than 58 C on the Mem Temp1/2/3/4. (Micron)
 
Lessons learned:
1. Wrong images were used on EVGA website (fixed)
2. GPU bracket is silly. There should be screws going from the back of the PCB into the block directly. The four closest screws to the GPU die should not be used to hold on a GPU bracket. This design failure puts pressure on surrounding screws to ensure the gap is closed. (note: those surrounding screws cannot adequately do that.)
3. EVGA over engineered their thermal pads. Thick thermal pads provide a premium feel but they highlight poor engineering standards. A thermal pad is meant to fill the gap between the chip and the block. Using thick thermal pads means EVGA is expecting a certain level of variance between blocks or they couldn't machine the blocks to come in such close contact with the chips. EKWB uses 1mm thermal pads on all of their blocks that I have owned, which tells me their machining is able to achieve a more precise and better product and they don't need thick thermal pads to compress the open space.
4. EVGA shows the GPU bracket being installed with the black side down and the pegs facing upwards on their documentation. I would argue against this design if you insist on using a GPU bracket or updating your documentation as the described/pictured method did not work for me.
 
Overall, I wanted to say thank you to Cool GTX, dwexpress, EVGATech_AdamB, bcavnaugh, EVGATech_LeeM, TahoeDust, and Cigs (reddit).
 
Most importantly, I wanted to say the biggest thanks to jinihammerer for allowing me to hijack your thread and for the many responses you gave. I can't repay you but I did use your affiliation code when registering my FT3 card as a token of my appreciation.

Two changes:

I used EKWB’s thermal pads for the memory chips and I placed the GPU bracket upside down, which goes against the instructions and pictures.

Other than that, I followed the directions exactly as described.