Hello,
im looking for some advice or experience on the MMCP, which is covering the PCB on my GTX 980 Classified. I am about to install my Morpheus Core Edition on the GPU and cant decide what to do with that plate, leave it or take it away.
Atm i think i am gonna put the heatsinks on the Plate, as direct as possible over the mosfets and memory. I suppose the plate will be pretty hot, especially over the mosfets and as long as something is hot, it will work to put a heatsink on it, right? :)
I will use a piece of copper plate (0.3mm) for the VRM Mosfets and the small Aluminium heatsinks that were included with the Morpheus over the memory chips.
What do you think? Do i need to remove the plate for direct contact? As long as the heatsinks will bring a few degree less temperature i would be happy. I suppose that the pads that EVGA uses between the chips and the plate are decent enough, same goes for the contact. At least thats what i hope.
For the case i take the plate of, i would have to use my own Pads and i dont know if they are good enough. Bought them in a PC shop, it was the only piece available, 80x80mm with 0.3mm thickness. Pretty cheap, 5,95eu from "Akasa"
next problem with the mosfets on the classified is, they seem to be double lined...14 mosfets and each one having "a little sister" a few mm next to it. So i cannot use the Aluminuim VRM heatsink given with the morpheus, which seems pretty nice. I would screw off the black pins and just fix it with the pads. But like i said, its not 1 line of mosfets, but 2.
Someone can share some own experience maybe?
thx and greetings from Germany
post edited by mannitu78 - 2015/12/24 08:27:11
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