darkheran

acxcoolerssuck

darkheran

acxcoolerssuck

Mangelwurzel
Video entitled "How to Install Thermal Pad Mod on EVGA GTX 1080 & 1070" on Gamers Nexus channel.
Just wondering what anyone makes of these comments made by someone named 'acnfanmanin':
 
 
"THATS NOT WHERE YOU PUT THE FRONT THERMAL PAD. You should put it on the HOTTEST part which is ON the baseplate itself. Those things you put on top of are CHOKES which doesnt get hot and dont mind being hot. You want the baseplate to be cold so it can cool the mosfets."
 

"No you're not supposed to put it on top of the chokes is what I'm saying. those things don't need cooling (look at motherboards and watercooling blocks they're never cooled) so you're wasting thermal pad contact area putting it there. You're better off putting it on the baseplate area on the right of the chokes because the mosfets which do get VERY hot are located under there connected to the baseplate."
 
"if EVGA told them to put it on the chokes...wt*...you're basically trying to cool a piece of copper...why"

well, this is interesting.
1. according to those ir images, the chokes/inductors & capacitors have got very hot too. 
2. placing pads on top the chokes/inductors to try making contact and spreading heat to the main heatsink is possible. but the efficiency should be very low in the case of acx3.0 because above main heatsink's fins of those chokes have not folded (90 degrees) so it is hard for the pads to spread the heat from the inductors to the main heatsink.  

Yeah the fins are what my concerns are with. Gamersnexus commented in their article that the method was certainly not the most desired choice but its the best they have come up with right now.
Article where they mentioned the fins

certainly the fins is vertical for the air to push through the heatsink and cool the midplate, in the original design.
so placing pads on top of chokes may really has a contact problem lol. consider how thick is each fin at that area above the chokes, lol. 
 
i personally will cut a thermal pad strip for the chokes only and place this strip on top of the chokes, just like msi gamingx.  but i wont place the pads on top of the midplate which covers the area of mosfets. because i am afraid the pads would block the airflow to cool the mosfet. i guess the midplate is a better heat collector than the thermal pad... blowing air to the thermal pad sounds very stupid.   

At that point it gets to advanced of a decision for me to comment on myself. I will probably apply the modification with the given materials. I mean given the thermal reduction shown through tests done by gamersnexus (of which im happy with the results shown) I can't see how it would be a bad option just doing it the way the thermal pad has been delivered.

luckyirishlad
Ok the question was asked re  EVGA 1070 SC Gaming


"Anyone with a trained eye that can tell if there´s a gap there?"





Lets take a look shall we





Give me a moment while i enhance





Result





Yep confirmed could park a bus in that gap .....Do not believe me well ...

gahelm
Gotta admit, that is funny.  

TheGuz4L
Anyone with a good eye can see if I have any gaps? From my eye it looks good to me. Mine was an RMA from early September from the EVGA California facility.

DSP1
 
Still posting your disinformation I see.
this kind of bs statement "all over the internet", only means if you look for it. Not only that, it is a handful of cases only. Not thousands of cases as you would like everyone to believe. They are all just re-postings! No one is falling for your lies.
And you are lying about getting names. If that were true you would be pming people here to add to your false class action lawsuit. Not only that you would be posting your lawyers name so we could all contact him to join in on your holy cause. rofl And also just because someone posts on a forum  or youtube does not make it true. Or do you still believe in fairies?
You really are making a fool out of yourself here.
Everyone needs to be made aware of your nonsense.

shannonjpower
You're all forgetting as Gahelm mentioned it's possible that having the pad directly over the mosfets and towards the back of the card it may wick away majority of the heat. That, coupled with the chokes not being covered allowing airflow through that area may yield better results. Generally this is how it's done on other branded cards and in the past.
 
But without any thermal testing now one can say which is better. Both would yield decent results I'd assume considering the only really area you need to focus on is above/below the mosfest.

panaikas

darkheran

Xfade81

Mangelwurzel
Video entitled "How to Install Thermal Pad Mod on EVGA GTX 1080 & 1070" on Gamers Nexus channel.
Just wondering what anyone makes of these comments made by someone named 'acnfanmanin':
"THATS NOT WHERE YOU PUT THE FRONT THERMAL PAD. You should put it on the HOTTEST part which is ON the baseplate itself. Those things you put on top of are CHOKES which doesnt get hot and dont mind being hot. You want the baseplate to be cold so it can cool the mosfets."
"No you're not supposed to put it on top of the chokes is what I'm saying. those things don't need cooling (look at motherboards and watercooling blocks they're never cooled) so you're wasting thermal pad contact area putting it there. You're better off putting it on the baseplate area on the right of the chokes because the mosfets which do get VERY hot are located under there connected to the baseplate."
"if EVGA told them to put it on the chokes...wt*...you're basically trying to cool a piece of copper...why"

But those are already cooled by the massive slab on the back. If i look at my own card with a light, the back seems the only way to give them extra cooling unless you want to remove the middle plate aswell.

Yes and putting anything beyond the mid plate in that section is still useless I would think if you only draw the heat to the midplate unless you added another pad above the midplate lol. Plus if you look at other aftermarket designs they seem to have pads on chokes too

darkheran you save me time with the pictures with the link above, today I start to see what other manufactures do with their cooler and collect pictures to edit.
acxcoolerssuck I have the same thought to cut a pad strip only for the chokes only and place this strip on top of the chokes, just like msi.
All of you talk about the vrm the last pages I also have some thoughts and start some search. 
I search to find how the other manufacturers make their cooling systems, they doesn't have thermalpad to backplate and baseplate that include the don't cover the whole pcb.
 
The fix with thermal pads that lower the temps 5C it's not a totaly fix, because the temps are trapped at thermal pads and that's why we see lower temps (personal opinion).
1)The baseplate has not contact with heatsink and has between them a gap about 1mm.
2)Also the thermalpad that supposed to put between baseplate and heatsink, to the point are location the VRM's under the baseplate they had thermal pad, so if we put the pad over the baseplate to same location as the intructions gave us EVGA it has no effect to cool the vRM's area.
3)The thermalpad for the backplate it was not necessary, hasn't point to put. 
 
I believe EVGA must desighn/make again the baseplate and that can throught direct air to vrm's area.
From the others manufactures the MSI,Zotac has the prefered system to cool the vrm's with the passive heatsink on them (that "hitted" with air).
 
Here are pictures
 
 
[font="verdana, geneva, sans-serif; font-size: 12px; font-weight: bold; line-height: normal"] 

darkheran
 

First you are not on a AMD chipset mobo right? Secondly if you are trying to flash Primary make sure you have the correct Primary file and are you sure you are on Master BIOS?

darkheran
 

Technically the thermal pad provides the most thermal reduction out of the two according to tests by gamersnexus. The left photo below shows ONLY the thermal pad fix (no VBIOS change or custom fan curves) This alone reduces the temperature from 109C to 85C in their testings. Adding only the VBIOS instead reduces from 109C to 95C. Adding both (as shown in the right photo) reduces from 109C to 81C. This means that the thermal pad (according to their tests) is the better solution. Whether the tests were properly performed or what other factors exists is a completely different question of course.

Just so its easier to read....

Change after VBIOS ONLY: 109C to 95C
Change after Thermal Pad ONLY: 109C to 85C
Change after BOTH: 109C to 81C

justinbkerr
Can anyone tell me what the Bios version should be after the update?
When I applied the update my screen when black, and after 10 min of waiting I rebooted.
 
No idea if 86.04.3B.00.82 is the updated version, or if applied the update is failing.
Don't want to try again and risk bricking the card for no good reason.
 
Part Number: 08G-P4-6183-KR
Part Desc: EVGA GeForce GTX 1080 SC GAMING ACX 3.0
 
From Log File
Operating System: Windows 10 Pro, 64-bit
DirectX version: 12.0
GPU processor: GeForce GTX 1080
Driver version: 375.70
Direct3D API version: 12
Direct3D feature level: 12_1
CUDA Cores: 2560
Core clock: 1708 MHz
Memory data rate: 10010 MHz
Memory interface: 256-bit
Memory bandwidth: 320.32 GB/s
Total available graphics memory: 16349 MB
Dedicated video memory: 8192 MB GDDR5X
System video memory: 0 MB
Shared system memory: 8157 MB
Video BIOS version: 86.04.3B.00.82
IRQ: Not used
Bus: PCI Express x16 Gen3
Device Id: 10DE 1B80 61833842
Part Number: G413 0000

DSP1
 
No idea about the '5 day rule', I never heard of that. But that  hardly proves that I am in the employ of EVGA regardless. It was a supposition on my part.
I had a thought though, why don't you take your campaign here 
These are the guys you need to complain to. You would be doing EVGA and their lawyers a favour. Well, maybe not. The last thing they need is the rantings of a crazy person to try and build their case.