Now that we have full reviews and all the information, I am interested to see others thoughts on the design changes EVGA made to the cooler on the FTW3 cards from last generation to this generation. Here is what I have noticed.
 

https://www.techpowerup.com/review/evga-geforce-rtx-3080-ftw3-ultra/2.html
 
The 3080/3090 FTW3 cooler uses a large cold plate that contacts both GPU and the memory chips. The heatpipes also make contact to the VRM components. Note that there is nothing else between the PCB and the heatsink. The heatsink screws into the backplate to give the card rigidity to prevent sagging. To remove the heatsink, the screws from the backplate need to be removed. On the 3080, the back plate does not have any thermal pads in the gap between the PCB. On the 3090, they use thermal pads and a flat heat pipe to cool the additional ram chips.
 
 

https://www.techpowerup.com/review/evga-geforce-rtx-2080-ti-ftw3-ultra/4.html
https://www.techpowerup.com/review/evga-geforce-rtx-2080-super-ftw-3-ultra/3.html
 
In the previous generation, there was an additional front plate/base plate between the main heatsink and the PCB. This was what made direct contact with the memory and the majority of the VRM components. The cold plate was also smaller and only made contact with the GPU. Additionally, you can see in the links provided that both the 2080 and 2080ti used thermal pads between the backplate and PCB. The backplate and front plate together were what provided the rigidity to the PCB, and the main heatsink could be removed to change paste with only four screws.
 
I am not saying I think one cooler is objectively better than the other, as I know there are changes between generations that alter the cooling requirements of the cards. However, I do think there are some clear changes in cooler design approach that have been made at EVGA. If you look further back at the 1080ti FTW3 design, that shares more in common with the 20 series design than the 30 series, so I wonder what caused the engineers at EVGA to decide to make these changes. I am very happy with my 3080 FTW3, just as I was with my 1080ti and 2080ti, but I wonder what the rest of you think about these changes.

Cool GTX
needed to remove more heat & the blow through PCB design

This makes sense, I didnt really think about it since the holes in the PCB are relatively small compared to how other AIBs have done with by having the heatsink overhang the end of the card. I'm sure that makes some difference though.