Hey guys! I wanted to make a suggestion to Jacob and Vince @Evga
 
I really really love how the SR3 Dark has the CPU orientation horizontal because inside a case the air flows from the front of the case towards the back since most cases have front intake to back exhaust fan setups.
 
So for good case temperatures, I think this is ideal, but now looking at the X299 dark where it has a vertical CPU Orientation, the 4th RAM on the right-side blocks off airflow. And if you have Tall RAM it is even worse.
 
So I was thinking that it is only a matter of time till X299 moves to a socket and a new chipset and when that happens you guys probably go under NDA and the engineers start the PCB Design for the tooling etc. But before that happens I am really really hoping that if Intel ever decides to go with a new socket for X299 successor like maybe Ice Lake X or Cooper Lake X or whatever ends up replacing the LGA 2066 CPU socket, I am really hoping that the future Dark Motherboards or really all future Dark Motherboards feature this horizontal CPU and RAM layout for better airflow.
 
Even the Z490 Dark has a horizontal CPU and RAM Layout and that gets better thermals in a case.
 
So yeah keeping my fingers crossed and hope you guys keep this in mind if maybe in 2021 or 2022 LGA 2066 is replaced with a new socket.
 

 
 

You have to consider there are many case configurations so your suggestion is ideal for air being pulled from the front of the case, but for those that pull air from the bottom, the vertical orientation could be more useful, especially if there is a radiator on the top of the case pulling hot air out. Either way, air is changing direction in the case, so CPU orientation, IMO, is case dependent.