If any of you were looking at the whole backside VRAM temperature thing & thinking what you can do to really improve those temps in a few not-so-easy-but-only-required-once steps, you can do more pads under the plate, then do thermal paste & heatsinks on top of the plate, and get some pretty pawgers-level temperature reductions:
Those are peaks seen during a 36-minute stress test. Middle is with pads between the heatsinks & backplate, as well as pads added under the backplate, the right result is with Kryonaut between the heatsinks & backplate. And temps are listed in the order of GPU, GPU2, Mem1 Mem2 Mem3, Memory Junction Temp, PWR1-5 in order. 14.8C drop in Mem1 temp tells me Mem1 is almost definitely a backplate-side VRAM chip readout. And Mem3 is definitely face/Die side, because it doesn't seem to be effected by this stuff much at all, I would assume that's all PCB heatsoak reduction resulting in slightly lower temps.
Inforino on pad sides etc is in the thread I have going about all this craziness. I'm doing all the different setup tests so others don't have to ^_^