It should be the same as the FTW3. These putties may work but should be confirmed with EVGA tec support.
silicon https://www.digikey.com/e...gy/TG-PP10-500/6204864
non-silicon https://www.digikey.com/e...gy/TG-N909-30/12581436

ty_ger07

PolarisX
When disassembling the XC3 is this one of the cards that has thermal putty over the inductor line that needs to be replaced?

I wouldn't say that it needs to be replaced.
 
Edit:
Fixed links:
https://www.digikey.com/en/products/detail/t-global-technology/TG-PP10-500/6204864
and
https://www.digikey.com/en/products/detail/t-global-technology/TG-N909-30/12581436

Thanks for the links.  I looked at Laird tputty at Mouser.  Wanted to use the same brand if I can't re-mold the existing putty to mate with the block/heatsink.  The parts list picture shown with the hybrid kit only has a paste packet.  Will need to contact support as the kit approaches shipping status.  Got time to plan.

I hope the kit includes new pads/putty for everything.  It would be disconcerting if EVGA prioritized aRGB and radiator thickness over performance.

I am surprised that the stock thermal putty would turn to chalk so quickly.  Why is that?  I am really surprised that you wouldn't be able to reuse it so soon in the product's lifecycle.
 

NICROD
Fujipoly has some 3mm 6 W/mk, or you could double up some 1.5mm 11, or 17 W/mk pads if you want to splurge.

And end up with 6W/mk.  Don't do that.  You will pay more for the same result.

NICROD
Dang, you think it would end up with that much of a hit? 

Yes. If you double the thickness, you drop the W/mk in half.  But then,  you also have a potential discontinuity in the middle between the two pads, so actually end up with less than half W/mk.
 
I figure, if you double a 11 W/mk pad, you will end up with less than 5.5 W/mk.  If you double a 17 W/mk pad, you will end up with less than 8.5 W/mk.  Neither are significantly different than 6 W/mk.