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Intel’s Next-Gen 10nm ESF Based Sapphire Rapids Xeon CPU Die Shot

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Xavier Zepherious
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2021/04/30 06:33:01 (permalink)

 
 Unveils MCM Design & Up To 80 Cores In 4 ChipletsThe CPU will additionally come in HBM configurations with up to 64 GB capacities (4 x 16 GB stacks) and will also feature DDR5 and PCIe 5.0 I/O onboard. Another interesting thing is that the LGA4677 chips will feature a gold-plated IHS and feature a soldered design with liquid-metal TIM. The IHS on the Sapphire Rapids chips is also brand new but the chip itself comes in the same rectangle shape that we have seen on previous Xeon offerings.
 
https://wccftech.com/inte...o-80-cores-4-chiplets/


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#1

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    Cool GTX
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    Re: Intel’s Next-Gen 10nm ESF Based Sapphire Rapids Xeon CPU Die Shot 2021/04/30 07:47:07 (permalink)
    interesting possibilities, but at what cost ?
     
    the core count was the most interesting part of the read

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    henrickd
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    Re: Intel’s Next-Gen 10nm ESF Based Sapphire Rapids Xeon CPU Die Shot 2021/04/30 10:36:57 (permalink)
    This is beautiful. However, I'm confused. Where does the HBM go? Also does anyone have any information on the small die on the bottom right?
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    kougar
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    Re: Intel’s Next-Gen 10nm ESF Based Sapphire Rapids Xeon CPU Die Shot 2021/04/30 14:08:15 (permalink)
    Very interesting, though the gold layer is not new. Intel has always used multiple thin layers on the underside of the IHS for solder bonding purposes, including one layer of gold. It's why Intel tried to switch to TIM because TIM didn't need all those extra manufacturing steps.
     
    I'm with henrickd, I really want to know what that tiny die is. My best theory for the moment is it's IO, either DDR5 or PCIe 5 related.


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