hellray2k
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I am getting my new CPU cooler in a few days and I have been reading that the dot/rice grain method is the ideal method to go with for applying thermal compound. However, I read on Arctic's website that the vertical line method is what they are recommending. I am using AS5, which method (dot/ vertical line) is the recommended one and yield the best performance and temperatures? Thanks!
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peeler05
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Re:i7 and thermal compound applications
2011/12/27 12:09:00
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Depends on your cooler. What is your new cooler?
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Re:i7 and thermal compound applications
2011/12/27 12:11:48
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Usually I do a vertical line. Since the CPU is lower on both sides. But I lap mine, then just do the pea size method.
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hellray2k
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Re:i7 and thermal compound applications
2011/12/27 12:30:09
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peeler05
Depends on your cooler. What is your new cooler?
I have a GeminII S coming. It seems the copper pipes are exposed and have gaps in between:  Will this be an issue for unevenness if I use either the dot or vertical line method?
post edited by hellray2k - 2011/12/27 12:32:40
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peeler05
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Re:i7 and thermal compound applications
2011/12/27 12:36:22
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The best way to go with that cooler is to run a very thin verticle line down each copper pipe. What people do with a surface like that that has dividers between the pipes, is they put a then line about 1/3 of the total length on the middle divider surfaces as well. AS5 has a cure time, so it could take up to 100+hours for you to get the full benefit from that compound.
post edited by peeler05 - 2011/12/27 12:52:11
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hellray2k
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Re:i7 and thermal compound applications
2011/12/27 12:49:17
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Awesome! Thanks for the tips!
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Re:i7 and thermal compound applications
2011/12/27 12:50:35
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No problem! Hope it works great! I just don;t like the looks of that cooler. Don't like how those copper pipes run right there, and have those gaps and such... Hopefully it works good though!
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peeler05
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Re:i7 and thermal compound applications
2011/12/27 12:53:34
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EliteGeek91
No problem! Hope it works great! I just don;t like the looks of that cooler. Don't like how those copper pipes run right there, and have those gaps and such... Hopefully it works good though!
Yea thats a trickey surface. I like the layout of the evo 212 better since the heatpipes are all connected and flush, so there is no diverders between them, but im sure that cooler will work fine.
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hellray2k
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Re:i7 and thermal compound applications
2011/12/27 13:05:20
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EliteGeek91
No problem! Hope it works great! I just don;t like the looks of that cooler. Don't like how those copper pipes run right there, and have those gaps and such... Hopefully it works good though!
Heh, yeah that's what I get for paying cheap, and also because I had a gift card to go with it. Hopefully it will work out. 
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loveha
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Re:i7 and thermal compound applications
2011/12/27 14:55:43
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Some people will also take a credit card and fill the gaps in the heatsink and then do the dot method.
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Re:i7 and thermal compound applications
2011/12/27 14:57:10
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loveha
Some people will also take a credit card and fill the gaps in the heatsink and then do the dot method.
That would work great. I'd do that method.
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hellray2k
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Re:i7 and thermal compound applications
2011/12/27 15:02:43
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loveha
Some people will also take a credit card and fill the gaps in the heatsink and then do the dot method.
Doesn't that create air bubbles?
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Re:i7 and thermal compound applications
2011/12/27 15:04:14
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hellray2k
loveha
Some people will also take a credit card and fill the gaps in the heatsink and then do the dot method.
Doesn't that create air bubbles?
Not if you fill in all the gaps right. That's the point of it. If you just stick paste on, and seat it. Then bubbles might be stuck in the gaps, so that's why he said to fill the grooves in first.
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hellray2k
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Re:i7 and thermal compound applications
2011/12/27 15:16:08
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EliteGeek91
hellray2k
loveha
Some people will also take a credit card and fill the gaps in the heatsink and then do the dot method.
Doesn't that create air bubbles?
Not if you fill in all the gaps right. That's the point of it. If you just stick paste on, and seat it. Then bubbles might be stuck in the gaps, so that's why he said to fill the grooves in first.
I have been Googling around, and apparently there are versions with the surface evened out:  Hopefully, I will be sent this version and not have to worry about the other technicalities.  Thanks again for the input!
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diegorubeus
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Re:i7 and thermal compound applications
2011/12/27 18:46:44
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let us now which version you got and how you applied the thermal paste on it.
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hellray2k
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Re:i7 and thermal compound applications
2011/12/29 10:19:44
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diegorubeus
let us now which version you got and how you applied the thermal paste on it.
Updates: Definitely got the uneven surfaced. So I took a credit card and filled in the groves like you guys recommended, went with the dot method, and got it running. At an OC of 3.4 with 1.3v, the idle temps were around the same at my stock cooler; around low 30s Celsius, not much improvement there. But under load with 2 Intel Burn Test running the temperatures were at high 60s Celsius; improvement! At an OC of 3.6 with 1.45v (I need to mess with the voltage a bit, this was stable, but I'll try to lower the voltage to see if it is stable too/ getting lower temps), the idle temps went up to high 30s Celsius, and when under load with 2 Intel Burn Test, it reached up to 82C max. Maybe it's like peeler05 said, it takes up to 100+ hours for me to see the benefits on AS5. Btw, is it just AS5 that takes up to 100+ hours for a cure time or do all Arctic Silver thermal compounds do that? Thanks for the help all! 
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loveha
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Re:i7 and thermal compound applications
2011/12/29 11:07:46
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hellray2k
diegorubeus
let us now which version you got and how you applied the thermal paste on it.
Updates: Definitely got the uneven surfaced. So I took a credit card and filled in the groves like you guys recommended, went with the dot method, and got it running.
At an OC of 3.4 with 1.3v, the idle temps were around the same at my stock cooler; around low 30s Celsius, not much improvement there. But under load with 2 Intel Burn Test running the temperatures were at high 60s Celsius; improvement!
At an OC of 3.6 with 1.45v (I need to mess with the voltage a bit, this was stable, but I'll try to lower the voltage to see if it is stable too/ getting lower temps), the idle temps went up to high 30s Celsius, and when under load with 2 Intel Burn Test, it reached up to 82C max.
Maybe it's like peeler05 said, it takes up to 100+ hours for me to see the benefits on AS5. Btw, is it just AS5 that takes up to 100+ hours for a cure time or do all Arctic Silver thermal compounds do that?
Thanks for the help all!
Ceramic doesn't take any cure time if I am correct, I haven't touched AS5 since I first started building computers. I saved that stuff for other peoples builds I would do for them. I use IC7, used OCZ Freeze till they stopped making it. PK1 is something I am going to try when my tube of IC7 runs out.
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hellray2k
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Re:i7 and thermal compound applications
2011/12/29 11:51:59
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Isn't Arctic Alumina Ceramic a thermal adhesive as oppose to thermal grease? I heard that stuff sticks on like epoxy like bye bye CPU haha? 
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loveha
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Re:i7 and thermal compound applications
2011/12/29 15:49:30
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hellray2k
Isn't Arctic Alumina Ceramic a thermal adhesive as oppose to thermal grease?
I heard that stuff sticks on like epoxy like bye bye CPU haha?
They make something else that does not affix your HSF to your CPU. Either way I would finish off that tube of AS5 and get somthing better next time.
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hellray2k
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Re:i7 and thermal compound applications
2011/12/29 17:38:59
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loveha
hellray2k
Isn't Arctic Alumina Ceramic a thermal adhesive as oppose to thermal grease?
I heard that stuff sticks on like epoxy like bye bye CPU haha?
They make something else that does not affix your HSF to your CPU. Either way I would finish off that tube of AS5 and get somthing better next time.
Nevermind, Arctic Alumina Ceramic is not the same as the Arctic Alumina Adhesive, I got them confused haha. I'll probably try your suggestions after my AS5 is done, thanks!  Updates: Reseated the cooler and lowered my core voltage; getting around 79 Celsius max now under 2 IBT @ 100% load. Not bad for a cheap cooler haha! 
post edited by hellray2k - 2011/12/30 00:30:47
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jeffgoatley
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Re:i7 and thermal compound applications
2011/12/30 16:06:13
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☄ Helpful
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peeler05
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Re:i7 and thermal compound applications
2011/12/30 16:08:01
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jeffgoatley
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Re:i7 and thermal compound applications
2011/12/30 16:11:31
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jeffgoatley
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Re:i7 and thermal compound applications
2011/12/30 16:12:37
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Funny you just posted the same thing
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peeler05
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Re:i7 and thermal compound applications
2011/12/30 16:17:17
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:) Great site tons of info.. +1 Arctic Silver Thermal Compound Precautions: 1) Don't put it in your mouth. I figured this one out the hard way =/
post edited by peeler05 - 2011/12/30 16:21:26
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jeffgoatley
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Re:i7 and thermal compound applications
2011/12/30 16:20:48
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There's more to that review than just the comparison of the thermal paste. I don't know why they made the review out to be about the thermal paste only because there's a lot of good things to learn all the way through other than just the comparison of them, but whatever. Check it out if you get the chance. Happy New Year.
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Re:i7 and thermal compound applications
2011/12/30 16:28:39
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I don't know about the taste, but whatever you do don't get it on your motherboard because AS5 is a conductive paste. Just make sure it's cleaned up after install and before you plug it in.
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peeler05
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Re:i7 and thermal compound applications
2011/12/30 16:39:41
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Best way to "break in" that AS5 and get the 200 + hours is to fold. You get evga bucks in the process and its for a good cause!
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hellray2k
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Re:i7 and thermal compound applications
2011/12/30 16:48:44
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Re:i7 and thermal compound applications
2011/12/30 16:48:47
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I think you can reduce that time by tinting the CPU before applying the paste as a grain of rice/BB. Right or wrong, Anyone?
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