https://www.techpowerup.com/303163/thermaltake-shows-off-new-cte-case-form-factor-to-enable-higher-airflow Thermaltake in its CES 2023 booth, showed off a new line of PC cases that introduce its proprietary-design CTE (centralized thermal efficiency) "form-factor." Don't worry, you'll not need a new motherboard type to go with these cases. Thermaltake's idea here is to not just rotate the motherboard 90° clockwise (pointing all its I/O upward), but also position the motherboard tray itself toward the center of the case. This way, the front-, bottom-, and rear panels are dedicated entirely to fan-vents that can either be set up to maintain a high positive air-pressure, or hold onto radiators. On some of the larger models, there's plenty of room between the motherboard's top and the front-panel, so an additional column of fans (or an additional radiator) can be mounted along the vertical partition.
The CTE C750 Air is an example of a large case, with the CTE position of the motherboard freeing up four positions for radiators that are at least 360 mm and as big as 420 mm in size. This particular case has two additional 120 mm mounts along the top panel, so a total of 14 fan mounting positions are opened up. The CTE C700 Air is a slightly lower-depth variant that lacks the side-mounted row, and instead gives you 3x 120 mm mounts along the front- and rear-panels; 2x 120 mm along the bottom panel, and a 120 mm along the top. The CTE C700 TG and CTE C500 TG are smaller cases still, but still have mounts along the front- and rear-panels.
A very interesting way to mount the motherboard. The user also has lots of watercooling or air cooled options. Accepting a 420mm rad is also a strong point.
