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Intel LGA Socket 1700: Lower Height, New Hole Pattern

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rjohnson11
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2021/05/24 11:02:50 (permalink)
Intel LGA Socket 1700: Lower Height, New Hole Pattern Render Existing Cooling Solutions Incompatible | TechPowerUp
 
A few details have been let out on Intel's next socket, LGA 1700, which will be the one to accept next-gen Alder Lake CPUs. Apparently, Intel's LGA 1700 - which replaces the current LGA 1200 socket) will feature a lower height (by a full [1] millimeter, helping to further reduce socket load) as well as new mounting holes positions for cooling solutions. This would effectively render existing cooling solutions incompatible with Intel's next-gen CPUs - it will be up to your cooling solution provider to offer a new cooler bracket that's compatible with the new LGA 1700 socket. If the manufacturer doesn't, it's likely you'll have to get a newer cooling solution that actually ships with the required adapter.

It has also come to light that Intel's next-gen Alder Lake-S will eschew Intel's quadrangular design for their CPUs, and instead introduce a rectangular design that's 35.5×45.0 mm. An interesting approach that places these CPUs closer in design to Intel's HEDT platforms, but likely a necessary change due to the expected new Big-Little core design in Alder Lake-S. Current information out in the wild says that Intel will keep on offering boxed cooling solutions for < 65 W TDP CPUs, while higher-performance parts will still ship absent of it. Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LGA 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler.
 
I'm sure 3rd party cooler manufacturers will be more than happy to sell newly designed coolers. 
 


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#1

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    firerain
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/05/24 11:46:37 (permalink)
    Intel wants to commit sudoku!

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    #2
    aka_STEVE_b
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/05/24 11:53:51 (permalink)
    even if they just made brackets to adapt to new hole patterns - are the current AIO coolers big enough of a plate to cover the entire thing .?
    Looks like the cooler companies would have to make entirely new head designs to cover it all. ?

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    #3
    OhmicFutility
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/05/26 14:23:52 (permalink)
    Coolers have been pretty consistent across multiple generations and most even contain universal adapter kits between AMD and INTEL cpus.
    Sadly, everything about this next generation suggests that my standard strategy of buying computer components for my next build as they go on sale through the year is increasingly not going to work.
    At this point, between the RAM, the PSU, and Cooler…ect… I think I will have to wait until everything is officially announced before I am able to judge the compatibility of anything.
    #4
    Fatexends
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/05/26 14:28:23 (permalink)
    I think it's weird that they can theoretically predict the manufacturing process years in advance but a new socket design is needed almost every new cpu release... Can't they like 'future proof' something like that?
    #5
    MrNishi
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/05/27 12:43:14 (permalink)
    I'm sure most coolers have enough surface area to cover that CPU, but I', not looking forward to tracking down another adapter if I decide to reuse my cooler. If it needs a new one I'll just gift a cooler to one of my friends, only really need an idea of an excuse to buy new parts.
    #6
    BoomBurst
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/06/02 01:59:40 (permalink)
    Oh wow, ahh wonder how the new cooler gonna be fitting this new size of chipset. Hopefully, the current gen cooler can support and have enough surface area for the new chip.
    #7
    the_Scarlet_one
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/06/02 02:24:42 (permalink)
    Fatexends
    I think it's weird that they can theoretically predict the manufacturing process years in advance but a new socket design is needed almost every new cpu release... Can't they like 'future proof' something like that?


    Intel has used the same size socket and hole pattern for at least 9 years.. so… not sure what you mean.
    #8
    Nereus
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/06/02 09:20:10 (permalink)
    firerain
    Intel wants to commit sudoku!

    How does one "commit" sudoku?


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    creed984
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/06/02 16:29:47 (permalink)
    I don't why the new mounting holes excite me so much. The current intel solution is pretty terrible compared to AMD. Hopefully it's something a little closer to that. I had to completely pull my MOBO when I went for an aftermarket cooler so I could install the dumb backplate.
    #10
    patrick2103
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    Re: Intel LGA Socket 1700: Lower Height, New Hole Pattern 2021/06/02 23:42:47 (permalink)
    RIP to future CPU only upgrades! Im not sure about this move from Intel...
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