wccftech - Samsung Agrees to Manufacture 24 Gb DDR5 ICs, Up To 768 GB Sticks Now Possible
 
“Samsung announced that it is manufacturing 24 gigabyte DDR5 memory capable chips after agreeing to the demand of enterprise customers, especially the market that utilizes cloud datacenters. With Samsung catering to those consumers, it will allow the company to create memory capacities of up to 768 gigabytes (per stick) to be used for client servers and offer higher memory options for those client's computers. In addition to this announcement, Samsung released details about its extreme ultraviolet lithography (EUV) DRAM.
 
Samsung showed consumers and enthusiasts their 512 gigabyte RDIMM that utilizes 32 x 16GB stacks that was modeled from 8 x 16GB DRAM products. The process allows for efficient signaling and keeps power levels down.
 
Samsung has the possibility of increasing the capacity of a 32 chip module to the aforementioned 768GB by taking 24 gigabit memory ICs and using them in what is considered 8-Hi stacks. With this process, the RDIMM could utilize a server CPU's eight channels that use two modules on each channel, thus adding over 12 terabytes of DDR5 memory. Currently, the Intel Xeon Ice Lake-SP processor can only support a maximum of six terabytes of DRAM.
 
There is no specific date set for Samsung to release 24Gb DDR5 memory chips.”
 
For both server and consumer customers, DDR5 appears to be arriving quickly.