https://www.techpowerup.com/269317/sk-hynix-starts-mass-production-of-hbm2e-high-speed-dram
 
SK hynix announced that it has started the full-scale mass-production of high-speed DRAM, 'HBM2E', only ten months after the Company announced the development of the new product in August last year. SK hynix's HBM2E supports over 460 GB (Gigabyte) per second with 1,024 I/Os (Inputs/Outputs) based on the 3.6 Gbps (gigabits-per-second) speed performance per pin. It is the fastest DRAM solution in the industry, being able to transmit 124 FHD (full-HD) movies (3.7 GB each) per second. The density is 16 GB by vertically stacking eight 16 Gb chips through TSV (Through Silicon Via) technology, and it is more than doubled from the previous generation (HBM2).

HBM2E boasts high-speed, high-capacity, and low-power characteristics; it is an optimal memory solution for the next-generation AI (Artificial Intelligence) systems including Deep Learning Accelerator and High-Performance Computing, which all require high-level computing performance. Furthermore, it is expected to be applied to the Exascale supercomputer - a high-performance computing system which can perform calculations a quintillion times per second - that will lead the research of next-generation basic and applied science, such as climate changes, bio-medics, and space exploration.
 
I suppose their competitors (such as Samsung) will have to offer a similar offering