Can we have an answer from all  "your house will burn soon" members ? 

yeah ACX 4.0 even if just for PR reasons needs like a Heatpipe directly touching the VRM, not just the GPU.  
 
the thermal pad solution (especially the one between the faceplate and the heatsink, which will collect DUST like crazy over time) is pretty Ghetto, but i'm not one to argue with results... next time though, Heatpipe!  

Good news .
The EVGA with thermal pads and with a custom fan curve (so acceptable Db level and heat) should now be atleast as well as others brands.
 
I'm not sure,
did they include the blackscreen issue in the 0.2 % ?
 
I should receive my 1080 FTW RMA tomorrow, I can't wait

Seb6440

ilyama
Can we have an answer from all  "your house will burn soon" members ? 

It doesnt change anything about "exploding parts" ...
They have proofs for that.
You take it funny but you wont if it happens to you.

Video card parts have been "blowing up", "burning up", and "catching on fire" for years.  This is nothing new.  I guarantee that EVERY video card from EVERY manufacturer has seen at least one example since the dawn of video card time.  According to EVGA, the defects per million trend for these cards is not significantly different than what is normal in the past.
 
Move along.  Move along.  We simply have an internet Reddit-style hype culture bringing out more examples of the 0.02% of cards which are having the same issues other video cards have had over the last decades.

Lazy_Bones

ZeroBANG
i think it is safe to say now that EVGA should ship Tinfoil Hats instead of Thermal Pads.  
 
GG on the Internet Panic though.... 0.02% failure rate and people panic like we are looking at the next 33% RROD situation.  

 
The missing thermal pads were, in my mind, a legitimate concern to have, as they were omitted by mistake and not design.
 
Worrying about the 0.02% is just plain silly. Especially since Evga has your back if you turn out to be one of the (very) few who has a capacitor blow up, and will most likely replace the card and any parts damaged by the card.

strictly speaking this is not a mistake but a design.
using midplate/cooling plate/base plate, whatever you call it, to cool the vram and vrm is nothing "wrong" and common eg msi gamings , galax hof, inno3d ichills..... 
midplate helps reduce gpu temp because two main heat sources on pcb are now separated to two independent heat dissipation (midplate and main heatsink). 
 
the way evga is now solving the problem is to connect two independent heat dissipation... which is not the native purpose of using midplate cooling.
 
some cards are using heat direct touch method to cool the vrm and vram from the main heatsink. these main heatsink design have a unique feature to cool the vrm and vram. to maximize the contact area of main heatsink to vrm and vram, horizontal fins (90 degrees folded) must be made. because evga was not intended to use main heatsink to cool the vrm, so the acx3.0 heatsink doesnt have folded horizontal fins to cool the vrm. 
 
however actually the result of adding pad between evga midplate and evga main heatsink is surprisingly good. it shows the chokes were very hot before and using heat direct touch method is way better to cool down the vrm temp. if evga acx3.0 heaksink has folded fins for cooling vrm then there will not be a thermal issue at all. reducing vrm temp also helps in lowering gpu temp a bit.  
 
adding pads to the back of the pcb for spreading heat to the backplate is really an additional way to cool the vrm and vram. there are few companies doing this like gigabyte waterforece and xtreme. if the midplate//main heatsink is good enough to cool the vram and vrm, backplate cooling is really optional and additional.   just simply dont trust backplate can help cooling performance without pads to make contact with the back of the pcb to the backplate.
 
 
 
 


 
 
 
the evga pad added between the midpate and acx3.0heatisnk:

 

I guess this would explain why the non-FTW cards (i.e. reference cards with ACX 3.0 cooler) have been fine as far as I know.

This article already relates to so many threads that have already been created...

bobmitch
Very interesting!  Seems that thermals are quite normal, which is good to settle the mind.  I always had one question.  The ACX 3.0 and SC versions of the card use the reference pcb with one 8 pin vs all the other cards having two 8 pin.  I always wondered of the extra power to the FTW, and Classified did something to accelerate or make the issue happen.  Very rarely do you read about a reference ACX 3.0 1080 or SC "blowing up".  Just a thought...

I mentioned this repeatedly that the FTW was having this problem, but it was overlooked regarding the power phases and it was completely relevantto the issues the 980FTW suffered, having almost the same issues. Even still, with this in mind, the 1080FTW still suffered with overheating problems. I think y'all learned something; stay away from the FTWs and stick the reference models, you'll get, probably, the same overclocking capability and save a good chunk of change. Live and learn I guess.

arokhantos
Suggestion to evga replace every card and recall all bad cards, mistakes happen no big deal, annoying defiantly.

Only 0.02% are "bad".  How can EVGA know which ones to recall until they fail?  Most likely there is nothing wrong with YOUR video card and most likely you DO NOT NEED the additional thermal pads.  Most likely you do not NEED to be here worrying or complaining.

ty_ger07

acxcoolerssuck
https://www.techpowerup.com/reviews/MSI/GTX_1070_Quick_Silver_OC/4.html
 
msi gaming series, almost every ic chips are fully covered, like mosfet, mosfet driver, voltage controller; some are really optional but msi gives users satisfaction and confidence. and the midplate has lots of fin to enlarge the heat dissipation area.  these are somethings i want to see in the next acx4.0 design. the most important part to evga is that please do not use the midplate to intervene users adopting other air cooler or aio cooler....

What is this? Why not use a thermal pad which is 3/4" longer?  Any why are they using standard cheap electrolytic capacitors when the competition is using Tantalum capacitors?

 

https://www.youtube.com/watch?v=xlvqUts9H9c

because the heatsink cant reach that two pad missing phases, and i am only talking about the mid plate design...
 
msi gamingx series is not using 4c85n like the fe card but 4c86n which is much more cheaper and weaker. but the new sliver card uses another mosfet from ubqi which should be a significant improvement.    if you take a look on colorful xtop, you shoulf find the xtop pcb is mostly the same as msi gamingx, with using 4c85n. i am not saying msi gaming x is a gread card in terms of pcb quality. 

tucker147

ty_ger07
 
What is this? Why not use a thermal pad which is 3/4" longer?  Any why are they using standard cheap electrolytic capacitors when the competition is using Tantalum capacitors?

 

That thermal pad is on top of the chokes which do not actually require any type of cooling. So it wouldn't matter if it were 3/4" longer. Those are polymer capacitors not electrolytic, plus radial lead capacitors have a smaller footprint on the pcb and so you can fit more of them then if they were to use SMD film or tantalum capacitors which results in less output voltage ripple. More caps = less ripple but lower efficiency. Less caps = more ripple but higher efficiency.  

i dont know anything about capacitor, could you tell me more about the grade of the fe pcb cap vs this msi using cap//which type of these two is better???thanks

tucker147
 
That thermal pad is on top of the chokes which do not actually require any type of cooling. So it wouldn't matter if it were 3/4" longer.

I know that the inductors generally don't need any cooling.  The point is that they CHOSE to cool them for one reason or another, and that being the case, why skimp?  I saw that acxcoolerssuck was advertising the card as an example of doing everything correctly, so I figured that I must point out their own areas where they lacked vision and lacked following through with their decision choice.  People are being extremely hard on EVGA claiming that EVGA made a bunch of bad design choices, when in actuallity, it has been shown that there really isn't anything wrong with EVGA's original design and all the hype is misguided, misdirected, and based on incomplete and innacurate information.
 

Those are polymer capacitors not electrolytic, plus radial lead capacitors have a smaller footprint on the pcb and so you can fit more of them then if they were to use SMD film or tantalum capacitors which results in less output voltage ripple. More caps = less ripple but lower efficiency. Less caps = more ripple but higher efficiency.  

Ok.
 
The funny thing is that EVGA's choice to use the nice, expensive tantalum capacitors could be the cause of the "burning" and "blowing up" images we have seen.  Or at least some of them.  Tantalum capacitors can catch fire or blow up.  There's no conclusive evidence at this point to point fingers at any one component yet, though.  All we really know is that this is an issue caused by defects (not a  design issue) which affects a small percent of the video cards.  The rate of defects is normal and similar to previous cards, according to EVGA.

I am "claimed".
 
"It is dumb.  It is stupid." Sure, whatever.  Actually, the MOSFETs tended to run under 100c according to Nexus's report with the default BIOS, default thermal pads, and highest possible load at stock settings.  And, as we know, 100c isn't really a big issue for these MOSFETs in the first place. But, whatever.  Just ignore those facts and dive off the deep end on some fanciful rant.
 
Everything EVGA did as a service to its customers by releasing a newer BIOS and by providing extra thermal pads was not really necessary in the first place and has actually damaged EVGA's reputation by making people think that EVGA is guilty of something, or has done something wrong, or made an error in its design.  It's really quite nasty the way people talk around here and demand things.  Somebody released a scare article which passed around the internet, EVGA reassured people that it really wasn't an issue and that their testing conclusively proved more than once that it wasn't an issue, but said that they would release free improvements to those who were still concerned.  Maybe EVGA would have been better off by not providing free extra thermal pads or an additional BIOS option.  At least that way, people wouldn't assume that EVGA has a guilty conscience.
 
As far as anyone who has thoroughly researched the issue can tell, there is/was nothing wrong with the design of the card; and the extremely small percentage of people who have had this "burning up" or "blowing up" issue, were affected by a manufacturing defect which is no more common in this product series than in any product series previously.  It has all become massively overblown.  If you do some searches online, you will find many card models from many card manufacturers with the exact same sort of burns for years or decades in the past.  It is "normal" in the sense of this imperfect world we live in surrounded by imperfect humans.
 
Move along.

ty_ger07
Only 0.0001% are "bad".  How can EVGA know which ones to recall until they fail?  Most likely there is nothing wrong with YOUR video card and most likely you DO NOT NEED the additional thermal pads.  Most likely you do not NEED to be here worrying or complaining.

Are there any rules that It is prohibited to expressing worries/complains etc.? If it's some wrong there are moderators to regulate the discussion, it's not a "member job"
 

ty_ger07
  People are being extremely hard on EVGA claiming that EVGA made a bunch of bad design choices, when in actuallity, it has been shown that there really isn't anything wrong with EVGA's original design and all the hype is misguided, misdirected, and based on incomplete and innacurate information.
 

 On the above replace the evga with an X(other company name), we pay for evga product (500€, 700€ 800€...) and don't care for other company at present, ιφ we pay for other brand and the X rcompany try to cut corners then we express our complaints.
 Now we complaints about the oversight, lack of the pads, the "optional pads" that running to give free, because they don't know what would happen the next months (if actually there is a problem), maybe bad caps/he usual mix of workmanship / supply-side quality control, but not the VRM temperatures (that are close to 100C and the luck of "lifespan") a lot of maybes I read from GN.
 
Why all those "noises" then? There are two posibilities:
α)False alarm, the person who made the statement beacause of the lack of informations, "prefer" to choose the chaos (this statement it's not made by responsible person) rather than EVGA look in details what is fault. They have/knew about the data of defective cards 200-300 at million but they took the decision by the panic that make to internet and causes the chaos. There is no excuse for a company that is EVGA.
or
β)there is oversight, problem, and now try to cover the situation with statements as optional, free pads etc.
EVGA must replace people from key positions
 
The whole situation  of above and especially if it is the false alarm, make us to over reacted (me too).
From a company like EVGA is, "you" wait a crystal clear stance.
At this time only the support team stood to the occasion

Lazy_Bones

ZeroBANG
i think it is safe to say now that EVGA should ship Tinfoil Hats instead of Thermal Pads.  
 
GG on the Internet Panic though.... 0.02% failure rate and people panic like we are looking at the next 33% RROD situation.  

 
The missing thermal pads were, in my mind, a legitimate concern to have, as they were omitted by mistake and not design.
 
Worrying about the 0.02% is just plain silly. Especially since Evga has your back if you turn out to be one of the (very) few who has a capacitor blow up, and will most likely replace the card and any parts damaged by the card.

I think it's all the hassle people are upset about.
 
I'm pretty happy with my experience but have had the Black screen + fan issue then after RMA was hit with the report of the missing thermal pads.
If I had waited and built my system now instead of 2 months ago, I'd save myself $400 (man those black friday deals make my wallet ache)  and would have gotten a 1080FTW with the pads and full confidence.
 
I guess that's the price I pay with technology. I know the depreciation curve tends to suck.
 
I do still worry about the secondary market for the 1080 FTWs for when I want to upgrade.  

dexters
If I had waited and built my system now instead of 2 months ago, I'd save myself $400 (man those black friday deals make my wallet ache)  and would have gotten a 1080FTW with the pads and full confidence.

The new cards have the same number of thermal pads as the old cards.  EVGA tech support said that they aren't adding extra thermal pads to new cards.  Since it isn't a defect or design problem in the first place, EVGA is not changing their product in this regard.  The additional thermal pads are only a free optional upgrade which users may choose to obtain from EVGA for a limited period of time.