Soooo it's not possible to mine on an aircooled 3090. I measured everything out, had proper pad thickness (2.0mm is good for front and back) and verified via disasembly that everything was making good contact. It doesn't matter, the vram on the back need active cooling that even a fan pointed at won't help.
You don't need 2.25mm pads. The gap between the copper and the front vram is about 1.3mm based on the standoff height. However you need to get above the metal gpu die package frame which is 2.5mm tall. So the VRAM is 1.0mm high, so if you put 2.0mm pad on top you get 3.0mm total height, which is 0.5mm of compression then down to the GPU package.
I know 2.0mm is fine for the front VRAM because I do that on 3080Ti's without overheating and every GPU regardless of the AIB is going to have the same 2.5mm gpu die package.
If you're gaming and asking what pads to use in a repad job:
Inductors: 1.0mm
VRM: 2.5mm
VRAM front + back: 2.0mm
VRM back: 3.0mm
All of these visually made good contact with Gelid Extreme 12W/mK pads that are fairly squishy, and I calipered the heatsink and pcb to make sure I was hitting 20-30% compression ratios. You need to warm up your pcb / pads a little bit (don't do it in a cold room), make sure to press them on with your thumb to squeeze out any air bubbles, etc. Make sure they're cut fairly precise because there's some capacitors near the VRAM that you don't want getting pinched on a thermal pad. This is basic stuff that should be standard on any GPU pad job.
IMO ignore the Kritical or Gelid Ultimate pads. They're just so stiff that you're begging for trouble especially on a lot of 3000 series cards where they don't really use that many screws to clamp everything together. On the 1000 series you would have 9 screws holding the heatsink down so you could get away with stiffer pads.