cnet - Intel details comeback plan to leapfrog chipmaking rivals by 2025
“Intel unveiled on Tuesday a smorgasbord of new technologies designed to help it reclaim processor manufacturing leadership within four years. The plans also bear the fingerprints of newly installed CEO Pat Gelsinger, who has pledged to restore the company's engineering leadership and credibility.
The developments include a new push to improve the power usage of Intel chips, a key element of battery life, while simultaneously raising chip performance. The technologies involve deep redesigns to how processors are constructed.
One technology, called RibbonFET, fundamentally redesigns the transistor circuitry at the heart of all processors. Another, PowerVia, reimagines how electrical power is delivered to those transistors. Last, Intel is updating its Foveros technology for packaging chip elements from different sources into dense stacks of computing horsepower.
‘This is the first time Intel really put it all together. I think that's a direct result of what Pat's bringing to the party,’ said VLSI Research analyst Dan Hutcheson. ‘He's putting the tech people back in the driver's seat.’ "
There are a lot more details in the article. Intel is finally taking action to really improve their CPU product lines.