legit
If it was as simple as 6 MLCCs = Good, why are there quite a number of Asus TUF cards just crashing though?

Source? Who said ASUS TUF cards are crashing?

All I've been hearing through multiple forums is that MSI, Gigabyte and Zotac are crashing. All supposedly with 6+0 or 5+1 configuration.

And just to be clear, I'm not claiming that 100% of them are because of capacitors.

h ttps://www.youtube.com/watch?v=_e_KDqzlAbk
 
At the very end of this video i believe he gives a good indication of what may be going on.  Also, very cool feature by ASUS.

I wonder how big this will get

MemphisUFC
h ttps://www.youtube.com/watch?v=_e_KDqzlAbk
 
At the very end of this video i believe he gives a good indication of what may be going on.  Also, very cool feature by ASUS.

I just rewatched second half of stream. I see nothing that qualifies as "indication" of any kind. Can you timestamp please?
 

EDIT: i misunderstood the post, ignore this

I'd love to have Jacob come and verify some of this information for us. 

Nothing that BIOS-update won't fix.

Frammish
@kevinc313 - you may not like how Lokator said it, and Lokator may or may not know all about capacitors, but he paraphrased the article well and those are the same terms Igor used in the article. Also, there are many different kinds of ceramic and tantalum capacitors. Using the terms he used, Lokator was more specific about the caps than you were. Professionals do call them by their “formal” names when those differences are important to the conversation - such as here with these.
 

You're right, we wouldn't want anyone to get confused here and start putting thru hole parts on their surface mount pcb locations. 
 
For the rest of us, ceramic chip cap (ceramics) and tantalum chip cap (tantulums) works good so people will actually know what you're talking about.
 

And there is a cost difference. I don’t know what prices they are paying but there are 10 MLCCs or one poly in each of the six locations on the back of the board. If there was no cost difference, all boards might be using all MLCC caps like the ROG Strix. Why do you think the cheap boards are using polys? It’s because there is a price difference somehow and the polys are cheaper especially in a 10:1 situation. That’s 10 parts placements instead of one in each location using MLCCs. Maybe not a big difference price wise (you’d need to run all the numbers to know) but the lines will be faster when you use fewer parts. That has a cost and benefit.

 
You should look up the pricing on these parts and the placement speed of a typical SMT placement machine.  I'll wait.  Ceramics are used extensively all over the board and I'd bet that the difference in this case is literally pennies in parts cost and a matter of 2-3 seconds for an array vs. single.  I HIGHLY doubt the decision was driven by cost, but as I noted elsewhere any sane mfg would rather put on one part vs. ten if they can.
 
Regardless, you clearly know what you're talking about and I don't want to get into a navel gazing argument about it.  I'm just looking to refute the narrative that some AIB's are "cheaping out" by selecting some parts vs. others.  Heck, Asus could have had a warehouse full of ceramics to burn through and trouble getting tantulums, or other considerations with their implementation of the reference design where they selected the ceramics.

kougar
Looks like many companies shipped 3080/3090 cards with 6-poscap designs, then changed them? Glad to see EVGA's changed its XC3 and FTW designs, because every single image on Newegg shows all EVGA 3000-cards with the old 6-poscap design. Same for ASUS, MSI, etc. 
 
According to Igor the official NVIDIA reference spec calls for 1 group of MLCC caps, any AIBs that had designs with none were actually breaking spec. 

Any EVGA close up pic I've seen so far doesn't show signs of surface mount parts being replaced, they came out of the factory with the ceramics in the center.

Its all just speculation right now. You won't get a comment from EVGA yet.
 
Best case scenario its driver related.

Lokator
MLCC and POSCAP might be similar pricy to buy, but POSCAP might be easier to solder on the board ---> less work time ---> cheaper (yes, I am a noob)

- Asus heavily advertises its fully automated board production process, so for them it might not be an issue to solder more of these smaller MLCC on these boards?

- fully speculated from a noob

oh and nice, Jayz made a video about it, will blow up now I guess

They are all put on by machine on all cards.  Time difference is seconds.  Cost difference is pennies.

Thank you, everyone that used bots yesterday when I went to buy a 3090 Ftw3 Ultra and was gone before I could pay for it we’ll it was in the cart.
Karma

Gr3yGhost

Lokator
Will EVGA change it if true?

I hope all the AIB's do so when it comes to creating new batches. It would delay creating new supply to fill the demand. 

I have no idea as to the complexity of the tooling needed to precisely install such small devices, but from what i've seen in some assembly videos - they use automation for the majority of production, they could conceivably re-program the automated machine(s) that specifically deals with installing these to add 1 or more additional groups of these capacitors. 

This does however, increase cost of materials, slows production for a period of time - and causes additional cost to replace anyone who would wish (likely anyone who has this concern) with an updated board. 

The trickle-down effect of making such a production change could be costly. And as someone who runs a business, you want to use the most cost-efficient method as much as possible while also trying to deliver the same quality product. 
Watching Jayz video, I agree with him that the "free" option is a bios update to lower the clocks. 

But I am crossing my fingers, that all AIB's make a change for future production runs of these cards especially on higher tier cards. 

I'll also cross my toes hoping that the 3080 Hybrid has these 2 groups of MLCCs at the very least

Baring any conjecture that this is actually an issue period, to make a running change at the manufacturer is very little effort.  Just a matter of updating the program and loading the parts.  The parts are extremely common. Time difference is seconds.  Cost difference is pennies.
 
The bigger issue is if already built boards have to have the parts replaced manually, per location, going from one tantalum to 10 ceramics, that could take about 10 minutes by a fast expert worker in a plant in Taiwan, or 15-30 minutes by a worker in an RMA center in the US. 

Lokator
If FTW3 really has 6x POSCAP and Asus Strix 6x MLCC, I really consider waiting for the Strix.

Any Info if FTW3 really has 0x MLCC, 2x less than FE and 6x less than Strix?

Will EVGA change it if true?

I'm waiting for reviews of the FTW3 cards but the Asus Strix 3090 OC reviewed relly well
https://www.techpowerup.com/review/asus-geforce-rtx-3090-strix-oc/

The GN stream just showed a closeup of the 3090 FTW3 they are working with, it has the two ceramic arrays in the middle and they are original.