Dabadger84
Are you integrating it in to an existing loop, or tailoring a custom loop around the fact that it's going to have a Hybrid card in it?
 
Will be interesting to see the results, I've always thought the fitting size difference between Hybrid cards & custom parts (unless you buy that small) would cause pressure/flow issues on the side of the loop after the GPU - but never seen anyone do it & post about it so no way to know for sure.
 
Also, look at all that copper, yowie wowee. 

Dyezak
And I'll be running the water out of the card, then through 3x 360 radiators to bring it back down close to ambient, *then* going through the chiller.

kevinc313

sparetimepc

kevinc313
Doesn't somebody make a generic block that fits in the place of an AIO pump......?

I don't believe so because the 3000 series has a different bolt pattern around the chip I think.

 
Like this but side ports.
 
https://www.corsair.com/u...-Block/p/CX-9010012-WW
 
Asetek circular bracket pattern.  Use the stock bracket, but replace the pump with a block.

Dyezak

That's my design for my Chiller.  We aren't talking monster sub ambient temp requirements.  If I were in Phoenix where humidity levels were consistently below 20% then I'd have the capability of going REALLY cold, and the chiller might not keep up.  But I'm in Texas, and the humidity levels are my limiting factor in the loop design.  So I can't really push the loop temp too far below ambient before I would get condensation here.  A 1300w chiller should allow me to hit my goals without too much fuss.  Though I doubt a 400w chiller would be enough.  
 

christobol
 
Stacking GPU to CPU is really handicapping your CPU's chilling.

christobol

Clovis559
 
 
Don't expect to see me with this working anytime soon,  but if you get this chiller setup first with ambient, you can put the computer in a minifridge and pump the water in from the outside. The mini fridge will help drop your ambient temps and humidity. Then you can hang nets inside with Silica beads inside to drop the humidity down even further. I imagine one fan would be enough to circulate the air so it makes contact with the beads, or I don't know if you would even need that. You would still want to condensation prep your PC in the many ways...
 

You would need to chill your VRM and NV.ME with water too if you went that route.  A frig is insulated, which works both directions.  The heat from the VRM and NV.ME could very well overwhelm the chiller on the frig since it's not a medium duty chiller.  It's designed to function in a limited capacity and really utilize the insulation to help keep things cold.  

Dabadger84
So far the heatsink dealio looks promising as others have stated it is, quoting from another thread I posted the info in:
 

So I looked at the only other stock run of PR I have a screenshot of with GPU temps fully listed.
 
Pre-heatsinks & vertical mounting installation, Peak Temps during Port Royal were (Don't have GPU main temp for some reason):
GPU 2 hit 52C, Mem1 50C - Mem2 54C - Mem3 48C, PWR1 48C, PWR2 41C, PWR3 46C, PWR 4 32C, PWR5 34C
Post heatsinks on the back (which are not over VRM areas at all):
GPU 2 hit 50.9C, Mem1 44.0C - Mem2 50.2C - Mem3 47.0C, PWR1 47.5C, PWR2 40.2C, PWR3 45.8C, PWR 4 31.9C, PWR5 32.5C 
 
If that sort of effect on memory temps holds, that's pretty impressive for some simple rinky-dink aluminum heatsinks being thermal-taped to the back of the GPU.  The only other factor could've been ambient temperature, but I'm fairly certain the previous stock run was done at 70F ambient, the one I ran today after the installs was run at ~71F.
Makes me think Mem1 is on the back of the card, because that's where I tried to get the heatsinks as close to as possible, over the back of the GPU core, and over around-about where the vRAM chips are on the top of the card.

 
That sort of a temperature drop from just some silly heatsinks thermal-taped on the backplate of the card is pretty darn nice.

Clovis559
This the company for EVGA's thermal pads?
 https://www.ziitek.com/
 
They got some decent rated stuff from 1.5 W/mK to 11 W/mK, wonder where this falls in there: 

_Gir_
I really dislike this sandwich hybrid cooler design.  Makes it a chore to compress the pad enough to make ideal thermal contact with the memory while trying to prevent that pressure from pushing back against the plate and preventing firm contact with the die.
 
BTW, great post overall, 1000 pts.

Dabadger84
My next phase is going to be more fins, going to do a set of 5 on each of the VRM areas of the backplate, then add some more to the core/vRAM areas as well.  In game it was even more notable reductions in temps from what I can see, despite me testing higher clocks/voltage, Memory readouts were cooler by 8.9C, 3.4C & 1.4C respectively at load (and to further prove how much those little heatsinks are doing, that's no memory OC, with an ambient of 70F before, vs a memory OC of +250MHz, with an ambient of 72F, for the after).  VRMs are a bit all over the place since they're not directly benefiting from the heatsinks much, but are benefiting from less heatsoak from the other components running cooler, VRM/PWR temps were down 0.5C, 0.1C, 3.8C, (same) and 0.2C respectively.  Die temps were about the same, with GPU 2 being down 0.5C - again, that's with lower ambient before, and with higher clocks "after" install, so overall, I'd say well worth the investment so far.
Hopefully doing the VRM areas of the backplate will help even further... the new ones I have coming are 20 x 20 x 10mm, so they're a bit taller in addition to bigger in size overall.  Definitely going to replace at least some of the current ones with those as well.  Ideally I'd heatsink like half the backplate, but we'll see.  Having a fan blowing over it combined with those is working out well though.
 
I wonder if a memory plate from a Hybrid cooler would work on the opposite side of the PCB, probably not due to alignment issues involved.  I do wish they sold the copper heatsinks from the face/die side of the card separately, I'd love to just pick some of those up for the backplate side, only put thermal tape where it's needed to help conduct the heat from components better... then the only place that would need additional heatsink-age would be the RAM chips & die area.