I am running at 4.8ghz right now at 1.27 vcore and 1.725 vccin, rest is on auto. Dimms are at 1.4v too. 
 
I do hit the thermal limits in stress tests of 100C, and I understand the processor will throttle itself to prevent damage. Idle temps are 35C
 
So the question is should I even bother to delid this chip? I feel for the work I do I never am going to run all cores max all the time so might not be a point. 
I have the tools right here and ready to go, but I don't know if there is a point to it. 
 
Anyone else not delided their cpu? 

Do it. Cooler temps means longer life.

So I delidded the cpu and put liquid metal on. But I didn't clean out the silicone and stuff so it still looks relatively stock. 
 
Will that make a big difference I saw on toms hardware it didn't?

a213m

boinger
So I delidded the cpu and put liquid metal on. But I didn't clean out the silicone and stuff so it still looks relatively stock. 
 
Will that make a big difference I saw on toms hardware it didn't?

Did you see an improvement in temperatures?
 
I would clean off the old silicone and reattach the IHS with black silicone sealant or black liquid tape, if stock appearance is important to you.

I did about 10-15C

Hoggle
Sounds like a nice improvement though as you said it's unlikely you will need it cooler since you are unlikely to max it.

Yea that's what I am thinking. Although 2 cores run rather 10C higher than the others. But they did that before too. I have it running at all cores 4900 Mhz right now except 2 at 4800Mhz. Vccin:1.76 Vcore: 1.305
 
Passes Occt with avx for 1 hr 
 
Seems decent. I don't know how much more I could get out of this chip. 

EVGATech_JoseR

boinger
So I delidded the cpu and put liquid metal on. But I didn't clean out the silicone and stuff so it still looks relatively stock. 
 
Will that make a big difference I saw on toms hardware it didn't?

Is it mimetic polyalloy?

Not sure what that is. 
 
But what i used is coollabratory liquid ultra. 

So I delidded the chip again and cleaned off the black silicone. Now my temps are actually 5C higher than they were prior to the delidding. And my same stable OC now seems unstable. 
 
Could it be I put on too little liquid metal ?
 
Edit: I think I know what might be the problem. Since the height of the IHS is now lower I am guessing I am not getting enough mounting pressure on the water block. I will shim the water block tomorrow and see if that improves things. 

boinger
So I delidded the chip again and cleaned off the black silicone. Now my temps are actually 5C higher than they were prior to the delidding. And my same stable OC now seems unstable. 
 
Could it be I put on too little liquid metal ?
 
Edit: I think I know what might be the problem. Since the height of the IHS is now lower I am guessing I am not getting enough mounting pressure on the water block. I will shim the water block tomorrow and see if that improves things. 

The correct amount of liquid metal makes a big difference, i delidded my 7980xe and wasn't satisfied so took it back apart and applied more liquid metal and made a big difference. i also removed all of the oem silicone and adhesive then just used a very minimal amount of silicone on each corner when putting it back together to just basically keep the lid in place. I also used the clear nail polish around the die in case of drip.

I run a delided 7040x with TG LM, I use 4.8 locked as my OC - full custom loop
 
For LM application this is a good video to watch -
 
 
Are you using LM between both the CPU / IHS and IHS / Water block?
 
When taking apart either the IHS or just the Block from the IHS you need to make sure you re spread the LM
 
 
Shimming should not be required, the height difference with the silicon removed from the IHS / Chip body should not be enough to affect how tight you can get your cooler tightend

boinger
Update. 
 
I was getting frustrated with the IHS. So I ended up just doing direct die. 
 
I got the derbuar direct die guard and set it all up. Strange no improvement in temps. In fact worse than ihs and when ihs was not cleaned.
 
I am really suspecting the waterblock is not making good contact or something is getting in the way. 
 
I am going to try a new waterblock and see how that goes. 

Before you buy new waterblock you could try to use some washers to increase mounting pressure.

I ended up with the best temps using a Rockitcool IHS with LM on my 7960x
1.22v 4.8ghz 68-72c under blender/cinebench runs with a lapped ek supremacy.
 
I had no luck going direct die even with a lapped block and i tried 3 different waterblocks from heatkiller and ek.  The die on my 7960x is very convex and i would always have a huge delta between the cores when delidded with no ihs no matter what kind of LM application. With the rockitcool ihs i see about 5-7c between the cores, i went through about 4g of lm testing many thermal solutions. If anyone wants a iceman delid die gaurd or a derbau8r die guard i will let them go cheap, the Iceman unit is actually much nicer and retains the stock backplate.

are you applying liquid metal to your block and die? do you have a screenshot of hwinfo64 showing the hot cores? if you have some cores overheating and some cores at reasonable temps then that is an application or contact issue, take the block off and use some regular thermal paste reinstall/ pull the block back off and look at the imprint, you can also try rotating the block. if you are delidded and have cores hitting tjmax it sounds like not enough liquid metal or it wasn't applied to both surfaces, even with terrible contact you shouldn't be getting anywhere close to tjmax on any core once delidded.

did you apply lm to the block and the die? you either dont have enough LM or it wasnt applied to both surfaces.
 
also how are you applying your overclocks your core voltages are all over the place and those hot cores never moved past 4200mhz which would indicate a bios setting even with a 92c peak they should have gone over 4200 at some point.
 

If you have no IHS you certainly should be using liquid metal otherwise there is zero point and you will have close to or worse temps than stock.
 
Whats happening is your die is convex and there is portions of the die not touching the block.  When you use LM this issue is not as significant. Rotate the block and see if you get better temps however i suspect you will not.
 
At this point you need to use some conducatnaut on the die and the block. Your bios settings are trying to compensate for a poor thermal bond which is not ideal. Also just set Adaptage voltage with no offset or a static voltage.
 
TJmax will not protect your cpu from degredation when you are pulling 400 watts through it at such high temps and voltages which huge temp discrepancy's across the die. pull the voltages and clocks back until you get the thermal solution sorted as you do not want to degrade your now out out of warranty chip.
 
 

With LM you need to be putting it on the contact area on both the chip and cooler (doesn't matter if you are using the direct frame or with the IHS put it on both) - if you were doing it on just the chip then that is part of the problem. Watch Buildzoid's video I linked above