did you use the rockit88?

how did you reapply the glue or adhesive to the lid? ive seen a few different methods

I bought the gelid gc extreme thermal compound along with some locktite superglue gel control for the lid.should I outline the lid with the locktite and leave the gap? or just secure the corners with it? also, how did u get the glue off the die? some reviews say to use a paper towel. thanks for the help lovha

I just did a delid two days ago  on my 7700K.  I used the Rockit88, CL LM Ultra for the TIM and used Permatex water pump RTV to reglue the IHS, this stuff is supposed to be easy to remove in case I need to remove the lid again. 
 
I ended up getting a decent temp drop, 15 is all I was able top record though.  Before the delid when I attempted 5.1 Ghz the temp shot up to 90 fairly quickly so I just stopped the stress test, I don't know where the temp would had peaked at.  This shot if after a Realbench stress test.  I also played 2 hours of BF1 with theses settings with no stability issues.  Overall I was very happy with the results although I may not have used enough liquid metal, my application was not the shiny pool that I saw on most videos. 
 

loveha
Depending on how thick your glue is, can be another factor on temps. Noticed some videos people would put TIM on the IHS and die. Only need to do this though really if you are using anything like what Intel used.
Using super glue, the IHS gets as close to the die as possible. Even saw a gif of an IHS spinning, so I only did the die and used super glue. I used just enough to put a thin coat.

Somewhere I read a theory that the glue they used was causing the poor thermal performance,  I was going to use superglue for this reason but someone said it may be harder to remove, I even though about not gluing it at all but I wanted some sort of glue, I put a BB sized dot on and old card and uses a toothpick to put a small bead on the rim of the IHS, my thought was that it would allow for closer contact but would remove more easily. 
Your results are quite impressive.  I may not have use enough TIM on the AIO water block, I was at the end of my tube so I ordered more and will re apply to see if that helps with mine.

Deliding can be fun if you have skills and knowledge. I didn't see it mentioned but just to let everyone know that if you delid a processor the warranty is void.

I saw results with i7-7700K are great after customers remove Intel's paste.
OC go and on 5.2GHz...
 

 
But its time to Intel design so fast CPU with 6 cores, capable to work on 5.0GHz.

I delided a 4790K gained about 400mhtz, temps were 15c lower.

I thought about offering delid services. Then once I thought about the cost of Coollaboratory Liquid Ultra, shipping the processor back, and that I have no way to test the CPU easily, it makes no financial sense.
Also, there is STILL that tiny chance something could happen. So I would be charging anywhere from $35 to $45. So once you factor the delid tool, relid tool, Coollaboratory Liquid Ultra, and shipping, YOU are in it for about $55.
How many CPU's would I have to do to reach a safety net in case something goes wrong?
Say I take in $20 just for CPU insurance, and an i7 7700K is $350, that is 17.5 CPU delids.
About every three delids I would need a new tube of TIM at $13. Shipping your CPU, lets just say $5.
 
For my first 18 delids...
$45 Delid Fee x 3 = $135
-$20 x 3 for first 18 delids = $75
-$15 for new TIM = $60
-$5 x 3 for shipping = $45
So I would intake $15 for my time on each CPU.
 
After I have the broken CPU insurance money.
$45 Fee x 3 = $135
-$15 New TIM = $120
-$5 Shipping x 3 = $105
 I take in $35 for each CPU.
 
This is not accounting for the alcohol and glue which would last long enough to not really factor to much into the cost.
So while it wouldn't be that bad, I have no way to test all of the LGA 115X CPUs. If I had the motherboards, and enough people interested in it to begin with, then yea, shops open.
So really, find someone already doing it, or do like I did, spend the $50, and have a delid tool sitting around for when you upgrade next. I don't see Intel going back to solder for the LGA 115X line of CPU.

Vlada011
I like more to stay with processors where deliding is not possible and heat transfer is much better.
1800X, i7-5820K, i7-5930K, i7-6900K, i7-6950X... that's better.
 

Also where price is much higher, unless you are looking at AMD.

Just dont do this when you do 

 
thats actually a old C2Q 775 that was dead anyways, but you can see the solder and what happens when you try and pop the top to have a look, two dual core dies under one roof, guess one was stronger than the other 
funny thing is i have done other 775 cpu's and they did not use solder, they were lower end celeron chips though, one P4 chip was also soldered. so it seems that intel decided to go with lower end way with a high end chip this time

I thought about lapping the CPU, but decided not to, do to how long it would take me. Maybe my next upgrade if they are still using TIM and I delid. My system was in use and I didn't want to be without my computer for the weekend.

Wouldn't hurt to test it. Thermal transfer would be sufficient till you started stress testing. That would be the test.

The rockit88 is a great tool