Nope, no tape for me.  I suppose you could use eraser on the back of the board, but I wanted to keep the overall thickness of the bottom mount to a minimum so I just sealed the board with the liquid tape. 

Q56_Monster

Is this the spot you're talking about John?  Circled in red.

yep, that's the spot Q. that sucker shows in all three pictures...big as day...lol
the on at an angle was how i seen the very first time..and was like with..it could have been me and my heat sink i don't know...but that ring around the circle. was a stock 920 heat sink.

xxrabid93

John, under your art eraser insulation (assuming that's what it is), did you put any kind of tape anywhere? I am going to start prepping a board for DICE today, and am not sure if i should put tape down, specifically around the socket. Look at this guy's 5th and 6th pictures to see what i mean: http://www.xtremesystems.org/forums/showthread.php?t=201916. But then it seems Buckeye at 411 and XS doesn't use tape: http://www.411overkill.com/forum/phpBB3/viewtopic.php?f=80&t=5552.

Your opinion on the matter?

ah yes..i know the buckeye one well.


i may try that tape around the metal again, because the first time i dont think i did it right. it was a condensation magnet. but i didn't have it fully covered in eraser either..i was testing something to see how well it held up. 

Yes, the eraser will work on the back of the board as well. Most people just cover the part in the middle of the plate. Than put the neoprene over that.

What about s775 where there is no backplate? Just cover the area under the socket?

Project done! My Ghetto bench table: http://forums.evga.com/tm.aspx?m=267039

Nice Rabid! Wait till you see mine.. I made it from a Dell case.. Well, more like the foam packing from the case. I need some acrylic to finish it though.

You could use a plastic dip coat as well.
Ive used plastic dips when i used to bench on DICE.
Sadly, real work got crazy and i have stopped benching since.
meh... SR-2 might just bring me back.. drool.... maybe i can finally try out LN2...

Q56 I wouldnt worry too much about it.
Clear the debris and leave everything as is.
for the hk 3.0 you want to just lightly sand the debris off if its stuck there.
DO NOT sand the whole block as some have mentioned, the HK 3.0 is bowed for a reason.

I heard the same thing about the heatkiller, and not lapping it because its designed for the misshaped i7.

I just lapped them both-problem solved ;)

lol Nate... Does it work better now?

I don't use my HK anymore... I use my super secret waterblock.  Both are lapped as well.  I may be posting it in the near future... when the field testing results are in.  Still waiting to see some records broken with the field testing model.