I believe that you are correct gregoryv, conductivity would be better if the thermal pad contacted a plate instead of directly to the fins.
Manufacturing a new cooler with a heatsink would be more effective, but also more expensive. Since the thermal pad is effective in its current implementation, the extra cost of a heatsink isn't necessary.

Your English is very poor so I'm having a hard time understanding what you're even trying to say.
 
Either way it does not matter. You are still somewhat restricted by the thermal pad sitting underneath the mid plate which makes direct contact with the mosfets (what you are calling the VRM).
 
If you are suggesting that EVGA do away with the mid plate and have the heatsink directly contact the VRM section then I don't even know where to begin. How is this possible given the variation in component heights? Even IF they were all identical there would still be small variations due to the soldering process. Making direct contact and thermal grease impossible to use.
 
If you really are an engineer certainly you can appreciate the insanely tight tolerances required for direct contact and just how difficult this would be to achieve on both the GPU and VRM section at the same time! It's simply not practical.
 
Also to add to this if you were an engineer you would easily be able to see that what you're asking is for the heat sink to be over engineered.
 
It's simply not necessary when EVGA can use a simple thermal pad like every other manufacturer has done for years now on GPU's, memory, motherboard mosfets, southbridges, northbridges etc etc.
 

stickywulf
I believe that you are correct gregoryv, conductivity would be better if the thermal pad contacted a plate instead of directly to the fins.
Manufacturing a new cooler with a heatsink would be more effective, but also more expensive. Since the thermal pad is effective in its current implementation, the extra cost of a heatsink isn't necessary.

How would conductivity be better when you are using the same thermal pads? Thermal conductivity being the speed at which heat energy travels through a material. What's it matter if the metal on the other side is better at conducting heat when the pad in the middle is the weakest link?
 
Sure the contact surface area on one side would be better, I'm not doubting that. However the metal plate will still need to be attached to the fins somehow. This is where you are also still going to have minimal contact!

GloR1ouS_
Just watch jaytwocents video. It literally shows you the difference so your super "smart engineering" brain can comprehend the difference.

Your answer is very nice and relevant

shannonjpower
Your English is very poor so I'm having a hard time understanding what you're even trying to say.
 
Either way it does not matter. You are still somewhat restricted by the thermal pad sitting underneath the mid plate which makes direct contact with the mosfets (what you are calling the VRM).
 
If you are suggesting that EVGA do away with the mid plate and have the heatsink directly contact the VRM section then I don't even know where to begin. How is this possible given the variation in component heights? Even IF they were all identical there would still be small variations due to the soldering process. Making direct contact and thermal grease impossible to use.
 
If you really are an engineer certainly you can appreciate the insanely tight tolerances required for direct contact and just how difficult this would be to achieve on both the GPU and VRM section at the same time! It's simply not practical.
 
Also to add to this if you were an engineer you would easily be able to see that what you're asking is for the heat sink to be over engineered.
 
It's simply not necessary when EVGA can use a simple thermal pad like every other manufacturer has done for years now on GPU's, memory, motherboard mosfets, southbridges, northbridges etc etc.
 

stickywulf
I believe that you are correct gregoryv, conductivity would be better if the thermal pad contacted a plate instead of directly to the fins.
Manufacturing a new cooler with a heatsink would be more effective, but also more expensive. Since the thermal pad is effective in its current implementation, the extra cost of a heatsink isn't necessary.

How would conductivity be better when you are using the same thermal pads? Thermal conductivity being the speed at which heat energy travels through a material. What's it matter if the metal on the other side is better at conducting heat when the pad in the middle is the weakest link?
 
Sure the contact surface area on one side would be better, I'm not doubting that. However the metal plate will still need to be attached to the fins somehow. This is where you are also still going to have minimal contact!

Sorry you cannot understand my English and what I am saying.
1. Why EVGA saying thermal PAD is not necessary and only optional?
2. I am attaching picture of other manufacturer and you can see that flat surface was designed and not fins.
Maybe now you understand what I am saying and if you have some issues with my professional level, we can discuss it.
 

 
 

I would really like to see some thermal images with the pads attached and WITHOUT a backplate. The same way Tomshardware did. Are there even any reports whether the pads will make any difference? 

gregoryv
Sorry you cannot understand my English and what I am saying.
1. Why EVGA saying thermal PAD is not necessary and only optional?
2. I am attaching picture of other manufacturer and you can see that flat surface was designed and not fins.
Maybe now you understand what I am saying and if you have some issues with my professional level, we can discuss it.
 

 
 

Where is the Mid Plate?

gregoryvSorry you cannot understand my English and what I am saying.
1. Why EVGA saying thermal PAD is not necessary and only optional?
2. I am attaching picture of other manufacturer and you can see that flat surface was designed and not fins.
Maybe now you understand what I am saying and if you have some issues with my professional level, we can discuss it.
 

 
 

1. I'll quote EVGA's article directly:

EVGA has investigated these reports and after extensive testing, below are our findings:

• On ACX 3.0, EVGA focused on GPU temperature and the lowest acoustic levels possible. Running Furmark, the GPU is around 70C +/- and the fan speed is running approximately 30% duty cycle or lower.
• However, during recent testing, the thermal temperature of the PWM and memory, in extreme circumstances, was marginally within spec and needed to be addressed.

Conclusion: EVGA offers full warranty support on its products, with cross-ship RMA*, and stands behind its products and commitment to our customers.
To resolve this, EVGA will be offering a VBIOS update, which adjusts the fan-speed curve to ensure sufficient cooling of all components across all operating temperatures. This VBIOS will be released in the next few days and users can download it and update their cards directly. This update resolves the potential thermal issues that have been reported, and ensures the card maintains safe operating temperatures.
 
For those users who want additional cooling beyond the VBIOS update, EVGA has optional thermal pads available. This update is not required, however; EVGA will make it available free of charge to any customer who is interested.

 
2. You're looking at 2 different designs, one with a mid plate and one without. You're comparing apples and oranges. Even still Gigabyte is using thermal pads which would no doubt have a thermal conductivity rating.
 
But if we are referring to the current EVGA design then I have already shared my opinion in my previous posts.

bcavnaugh

gregoryv
Sorry you cannot understand my English and what I am saying.
1. Why EVGA saying thermal PAD is not necessary and only optional?
2. I am attaching picture of other manufacturer and you can see that flat surface was designed and not fins.
Maybe now you understand what I am saying and if you have some issues with my professional level, we can discuss it.
 

 
 
 

Where is the Mid Plate?

bcavnaughWhere is the Mid Plate?

 
Gigabyte don't use one in their current designs.

gregoryv

bcavnaugh

gregoryv
Sorry you cannot understand my English and what I am saying.
1. Why EVGA saying thermal PAD is not necessary and only optional?
2. I am attaching picture of other manufacturer and you can see that flat surface was designed and not fins.
Maybe now you understand what I am saying and if you have some issues with my professional level, we can discuss it.
 

 
 
 

Where is the Mid Plate?

Not Really
This is a Mid Plate