I have some question to EVGA engineers.
I understand the logic for update Bios and raise fan curve to cool better all components on the card. Although I didn't have any issues with my card so far I understand I should update the bios. The thermal pads installation is offered but not mandatory by EVGA so why you offering this?
I am mechanical engineer and dealing a lot with different cooling issues in lasers and other high power devices.
I don't understand the effectiveness of solution of thermal pads applied on VRM components. One side of thermal pad strip is in touch with VRM modules. The other side is in contact with cooling fans. The contact surface is very small and not effective. So I don't understand the effectivenes of this solution.
Can you please provide thermal tests performed by EVGA with and without thermal pads.
See 10:40 on the video :
https://www.youtube.com/watch?v=URyG1OP8p8I The much more effective solution should include contact between the thermal pad and flat conductive surface but the radiator currently doesn't having it and contact with fins. The heat dissipated from VRM modules should be conducted by thermal pad to VRM surface and then it should be dissipated out by convection from the fins.
I suggest you to modify the heat sink that should include flat surface on opposite side to Vrams and using thermal grease instead of thermal pads.
I don't try to criticize your work and very like your professional products.
Please don't ignore my post and try to reply on my questions.
Best Regards,
Gregory