GFAFS

emsir

GFAFS

emsir
So your "evidence" is youtube? Well, please post the link (s) and let us see if you are right.

Sorry but for me now it's legal material, i will not share them on this forum for evident reasons.

You don't have anything to proof your statement. Your post is just pure rubbish. Your reason: it's legal materiel? Hillarious! 

Well, we'll see about that.

It's not forbidden to post links to youtube. If there are youtube videos about smoking vrm, everyone can watch it. To say it's legal materiel is rubbish. You are just posting negative stuff but misses facts. You got nothing!

raigeki
Hi. I have Evga GTX 1060 6GB. My Product number: 06G-P4-6163-KR Do i need bios update too? 

I think Jacob updated Post 821 that 1060's will not need the VBIOS update and that some SKU's will get optional pads available and to stay tuned for that.

Yes it was this...

EVGA_JacobF

carltonc
where are the bios updates for the 1060 cards?
 

BIOS updates on 1060 ACX3  cards will not be necessary, we will have the optional thermal pads for some SKU's so please stay tuned.

VRM refers to a Voltage Regulator Module.  A VRM commonly contains a mosfet (The metal–oxide–semiconductor field-effect transistor MOSFET, MOS-FET, or MOS FET is a type of transistor used for amplifying or switching electronic signals.) an inductor, and a capacitor.  The Mosfet is indeed the source of the heat in this circuit.  As others have stated, whether you use the term VRM or Mosfet is pretty much irrelevant as long as you are using the EVGA recommended solution and installation procedure.  If you are doing your own solution, you better understand what this circuit and those around it are, to avoid creating a thermal pocket that damages the card.
 
See Darkheran's post above for excellent pictures!
 
Yes I'm bored today....  

darkheran

raigeki
Hi. I have Evga GTX 1060 6GB. My Product number: 06G-P4-6163-KR Do i need bios update too? 

I think Jacob updated Post 821 that 1060's will not need the VBIOS update and that some SKU's will get optional pads available and to stay tuned for that.

Yes it was this...

EVGA_JacobF

carltonc
where are the bios updates for the 1060 cards?
 

BIOS updates on 1060 ACX3  cards will not be necessary, we will have the optional thermal pads for some SKU's so please stay tuned.

Thx for info. I appreciate for it.

shannonjpower

clee290
I know this sounds stupid, but I've never updated my GPU's BIOS before and I don't want to mess anything up. So I ran the update.exe file from the BIOS zip file, a command window opened up and I eventually press Y to confirm, then the window eventually closed. Is it safe to assume that the update is complete and I can restart my PC now?
 

Yes, once the window has automatically closed you are safe to reboot. Once you're back into windows you can check if the bios flash was successful using a tool such as GPUZ or going into the NVIDIA control panel>help>System Information and scrolling to the bottom where it displays the video bios version.

darkheran

clee290
I know this sounds stupid, but I've never updated my GPU's BIOS before and I don't want to mess anything up. So I ran the update.exe file from the BIOS zip file, a command window opened up and I eventually press Y to confirm, then the window eventually closed. Is it safe to assume that the update is complete and I can restart my PC now?
 

Yes if the prompt has closed you are good. There was a slight update successful message before the prompt closed for me but it was only maybe visible for half a second. Restart.

Thank you both!

darkheran

acxcoolerssuck

Mangelwurzel
Video entitled "How to Install Thermal Pad Mod on EVGA GTX 1080 & 1070" on Gamers Nexus channel.
Just wondering what anyone makes of these comments made by someone named 'acnfanmanin':
 
 
"THATS NOT WHERE YOU PUT THE FRONT THERMAL PAD. You should put it on the HOTTEST part which is ON the baseplate itself. Those things you put on top of are CHOKES which doesnt get hot and dont mind being hot. You want the baseplate to be cold so it can cool the mosfets."
 

"No you're not supposed to put it on top of the chokes is what I'm saying. those things don't need cooling (look at motherboards and watercooling blocks they're never cooled) so you're wasting thermal pad contact area putting it there. You're better off putting it on the baseplate area on the right of the chokes because the mosfets which do get VERY hot are located under there connected to the baseplate."
 
"if EVGA told them to put it on the chokes...wt*...you're basically trying to cool a piece of copper...why"

well, this is interesting.
1. according to those ir images, the chokes/inductors & capacitors have got very hot too. 
2. placing pads on top the chokes/inductors to try making contact and spreading heat to the main heatsink is possible. but the efficiency should be very low in the case of acx3.0 because above main heatsink's fins of those chokes have not folded (90 degrees) so it is hard for the pads to spread the heat from the inductors to the main heatsink.  

Yeah the fins are what my concerns are with. Gamersnexus commented in their article that the method was certainly not the most desired choice but its the best they have come up with right now.
Article where they mentioned the fins www.gamersnexus.net/news-pc/2661-evga-mosfet-failure-possible-from-thermal-runaway-scenario

certainly the fins is vertical for the air to push through the heatsink and cool the midplate, in the original design.
so placing pads on top of chokes may really has a contact problem lol. consider how thick is each fin at that area above the chokes, lol. 
 
i personally will cut a thermal pad strip for the chokes only and place this strip on top of the chokes, just like msi gamingx.  but i wont place the pads on top of the midplate which covers the area of mosfets. because i am afraid the pads would block the airflow to cool the mosfet. i guess the midplate is a better heat collector than the thermal pad... blowing air to the thermal pad sounds very stupid.   

gahelm
VRM refers to a Voltage Regulator Module.  A VRM commonly contains a mosfet (The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET is a type of transistor used for amplifying or switching electronic signals.) an inductor, and a capacitor.  The Mosfet is indeed the source of the heat in this circuit.  As others have stated, whether you use the term VRM or Mosfet is pretty much irrelevant as long as you are using the EVGA recommended solution and installation procedure.  If you are doing your own solution, you better understand what this circuit, and those around it are to avoid creating a thermal pocket that damages the card.
 
Yes I'm bored today....  

Exactly my point. We were discussing whether or not the pad would be best placed only over the mosfets and overlaying the back of the card, or over a larger area moving towards the front of the card as EVGA have instructed (where most of the components don't generate heat). I merely trying to educate others so when we refer to the mosfets, chokes etc they know exactly what we are referring to rather than the generic VRM.
 
My only concern here with EVGA's method is that it creates a poket where hot between the mosfets and inductors/chokes which can't escape. I guess until someone tests the 2 different methods than it's all just speculation as to which application yields the best results.
 
Either way, using EVGA's method or the method Scarlet used you can't exactly go wrong.

acxcoolerssuck

darkheran

acxcoolerssuck

Mangelwurzel
Video entitled "How to Install Thermal Pad Mod on EVGA GTX 1080 & 1070" on Gamers Nexus channel.
Just wondering what anyone makes of these comments made by someone named 'acnfanmanin':
 
 
"THATS NOT WHERE YOU PUT THE FRONT THERMAL PAD. You should put it on the HOTTEST part which is ON the baseplate itself. Those things you put on top of are CHOKES which doesnt get hot and dont mind being hot. You want the baseplate to be cold so it can cool the mosfets."
 

"No you're not supposed to put it on top of the chokes is what I'm saying. those things don't need cooling (look at motherboards and watercooling blocks they're never cooled) so you're wasting thermal pad contact area putting it there. You're better off putting it on the baseplate area on the right of the chokes because the mosfets which do get VERY hot are located under there connected to the baseplate."
 
"if EVGA told them to put it on the chokes...wt*...you're basically trying to cool a piece of copper...why"

well, this is interesting.
1. according to those ir images, the chokes/inductors & capacitors have got very hot too. 
2. placing pads on top the chokes/inductors to try making contact and spreading heat to the main heatsink is possible. but the efficiency should be very low in the case of acx3.0 because above main heatsink's fins of those chokes have not folded (90 degrees) so it is hard for the pads to spread the heat from the inductors to the main heatsink.  

Yeah the fins are what my concerns are with. Gamersnexus commented in their article that the method was certainly not the most desired choice but its the best they have come up with right now.
Article where they mentioned the fins

certainly the fins is vertical for the air to push through the heatsink and cool the midplate, in the original design.
so placing pads on top of chokes may really has a contact problem lol. consider how thick is each fin at that area above the chokes, lol. 
 
i personally will cut a thermal pad strip for the chokes only and place this strip on top of the chokes, just like msi gamingx.  but i wont place the pads on top of the midplate which covers the area of mosfets. because i am afraid the pads would block the airflow to cool the mosfet. i guess the midplate is a better heat collector than the thermal pad... blowing air to the thermal pad sounds very stupid.   

At that point it gets to advanced of a decision for me to comment on myself. I will probably apply the modification with the given materials. I mean given the thermal reduction shown through tests done by gamersnexus (of which im happy with the results shown) I can't see how it would be a bad option just doing it the way the thermal pad has been delivered.

shannonjpower

gahelm
VRM refers to a Voltage Regulator Module.  A VRM commonly contains a mosfet (The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET is a type of transistor used for amplifying or switching electronic signals.) an inductor, and a capacitor.  The Mosfet is indeed the source of the heat in this circuit.  As others have stated, whether you use the term VRM or Mosfet is pretty much irrelevant as long as you are using the EVGA recommended solution and installation procedure.  If you are doing your own solution, you better understand what this circuit, and those around it are to avoid creating a thermal pocket that damages the card.
 
Yes I'm bored today....  

Exactly my point. We were discussing whether or not the pad would be best placed only over the mosfets and overlaying the back of the card, or over a larger area moving towards the front of the card as EVGA have instructed (where most of the components don't generate heat). I merely trying to educate others so when we refer to the mosfets, chokes etc they know exactly what we are referring to rather than the generic VRM.
 
My only concern here with EVGA's method is that it creates a poket where hot between the mosfets and inductors/chokes which can't escape. I guess until someone tests the 2 different methods than it's all just speculation as to which application yields the best results.
 
Either way, using EVGA's method or the method Scarlet used you can't exactly go wrong.

Since the thermal pad is a better conductor of heat than air, I would guess that the heat radiated into the gap you mention would be considerably less since the primary heat of the Mosfet itself should be wicked away via the thermal pad leaving very little excess to be radiated through the sides into the aforementioned gap.  As you stated, a thermal study would be nice to confirm this.

shannonjpower

gahelm
VRM refers to a Voltage Regulator Module.  A VRM commonly contains a mosfet (The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET is a type of transistor used for amplifying or switching electronic signals.) an inductor, and a capacitor.  The Mosfet is indeed the source of the heat in this circuit.  As others have stated, whether you use the term VRM or Mosfet is pretty much irrelevant as long as you are using the EVGA recommended solution and installation procedure.  If you are doing your own solution, you better understand what this circuit, and those around it are to avoid creating a thermal pocket that damages the card.
 
Yes I'm bored today....  

Exactly my point. We were discussing whether or not the pad would be best placed only over the mosfets and overlaying the back of the card, or over a larger area moving towards the front of the card as EVGA have instructed (where most of the components don't generate heat). I merely trying to educate others so when we refer to the mosfets, chokes etc they know exactly what we are referring to rather than the generic VRM.
 
My only concern here with EVGA's method is that it creates a poket where hot between the mosfets and inductors/chokes which can't escape. I guess until someone tests the 2 different methods than it's all just speculation as to which application yields the best results.
 
Either way, using EVGA's method or the method Scarlet used you can't exactly go wrong.

Scarlet's method seems to be not good.
mosfets generate massive heat, we all know that.
mosfets heat will spread to the midplate via the pad. midplate is made by aluminum which is a good heat storage. i doubt the pad on top of the midplate is better...pads is a media only..in my opinion. and the pad blocks the air to cool the midplate directly.
we have to consider the fins above the mosfets and chokes and capacitors are not folded at 90 degrees, so it is hard to spread the heat from the midplate to the main heatsink.