q2klepto
Will the pads only have contact with the fins? Will there be a plate similar to how Palit or Asus cards are? If not, wont it be super inefficient and dry out eventually? 

There is already a plate. The way it is set up is PCB, Mosfets, Thermal pad, Heatspreader, air gap, fins, fans.

What you are adding makes it PCB, mosfets, thermal pad, heatspreader, thermal pad, fins, fan. There is nowhere to put a second plate.

Scarlet-Tech
 thermal pad, heatspreader, thermal pad, fins, fan

So wont the thermal pad dry out this way? Isnt it normally mosfet -> thermal pad -> heatspreader that is physically part of the rest of the heatsink?
 
Also inefficient? 
 
Here http://imgur.com/a/XGgn6 you can see the ROG Strix, ZOTAC AMP!, Gigabyte G1, Gigabyte Gaming all have plates

I guess its better than nothing - we should get a redesigned HSF assembly with the heatsink being the same as the heatspreader 
 
Super disappointed in my first EVGA purchase - first crazy coilwhine, now such a fundamental design flaw