Xfade81
 
I see dents but ok. Another user creating his own problem.

 
Hard to see but I see most with contact but mainly one without.
 
On the left hand memory row the top pad clearly has contact as its pretty uniform and looks slightly compacted. But in the same row that bottom one does look like it's not making any contact. You can tell by the lighting reflections and the pad having a convex shape to it. If it was making contact it would be either flat or have a concave rectangular shape where the memory module has created a dent in the pad itself. In simple terms it wouldn't be bubbling outwards.

shannonjpower

Xfade81
 
I see dents but ok. Another user creating his own problem.

 
Hard to see but I see most with contact but mainly one without.
 
On the left hand memory row the top pad clearly has contact as its pretty uniform and looks slightly compacted. But in the same row that bottom one does look like it's not making any contact. You can tell by the lighting reflections and the pad having a convex shape to it. If it was making contact it would be either flat or have a concave rectangular shape where the memory module has created a dent in the pad itself. In simple terms it wouldn't be bubbling outwards.

maybe you should post a photo here to support what you claim could be true.
Victim blaming

Are you quoting and asking me or Xfade81? You've quoted us both so not sure who you're referring to and I think my post is pretty self explanatory using the photo supplied.

TPI_The_Axeman
Here it is, thermal pads are clean and unblemished by chip indents. 

 
 
I find it difficult to believe none of them make contact. 1 or 2 maybe.

shannonjpower
Are you quoting and asking me or Xfade81? You've quoted us both so not sure who you're referring to and I think my post is pretty self explanatory using the photo supplied.

this is a indirect approach to see whether the pads are fully contacted with vram. 
however taking phoho from the top can only see three top vram chips... the rest are hard to check when heatsink and midplate are installed.
all these stock pads should be 1mm thick but clearly it is not enough to ensure all vram chips being cooled by the midplate.

NucleusX

TPI_The_Axeman
Here it is, thermal pads are clean and unblemished by chip indents. 

 
 
I find it difficult to believe none of them make contact. 1 or 2 maybe.

i dont think even only 1 making no cantact is acceptable.
we can check this problem from the top but only 3/8 can be checked.
and if we really find it then it means the problem is quiet serious.

Does anyone know the actual thickness of the default pads installed ? I think I'm just gonna buy
the next size up to compensate. Its true, not all memory modules can be observed accurately.

NucleusX
Does anyone know the actual thickness of the default pads installed ? I think I'm just gonna buy
the next size up to compensate. Its true, not all memory modules can be observed accurately.

1mm thick, i measured them when i first disassembled the card. and evga official said it is 1mm too. 

acxcoolerssuck
1mm thick, i measured them when i first disassembled the card. and evga official said it is 1mm too. 

 
1.5mm it is then. If thats not what EVGA sends out, then ill keep em for spares and buy my own.

NucleusX

acxcoolerssuck
1mm thick, i measured them when i first disassembled the card. and evga official said it is 1mm too. 

 
1.5mm it is then. If thats not what EVGA sends out, then ill keep em for spares and buy my own.

what evga is sending out about the thermal pads request is not for the stock pads replacement but rather additional pads for additional purpose. the bad contact problem is not an additional problem but it is the nature of the cooling.