Thanks EVGA - Prize Build! (BANDWIDTH WARNING!)

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TigerDeath
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2013/07/14 16:10:33 (permalink)
 I would like to start off by saying a big THANK YOU to EVGA for putting on such great contests so we can all compete and have a chance to win some prizes!
That being said, this build started when I received my X79 FTW motherboard in from the Frosty’s All-Servers Gaming Event back in November/December of 2012. It was a few months before I could get all the parts in to put everything together, but with the help of some fellow clan members (Thanks Dedaciai for the chance to purchase your old case!), things finally came together a few weeks ago and I had everything sitting in my living room.
I asked for input here in the forums and did get some feedback, and that is directing some of my purchases; however this computer was mostly purchased and put together with haste due to my other rig failing on me, as well as the video card going out. For all of the benchmarks that I have done, I am forced to do them with a GTX 260 SC Core 216 instead of my normal GTX 670 SC.
The rest of my parts list is:
Some pictures of the build:
Well, I had some pictures of me opening the boxes and such, but I’m not sure where I put them… I will be sure to upload them when I find them (I’ll edit this thread). 
It all started when I gathered everything and finally purchased all my last parts (Not sure where the mobo is in this picture… Kind of dumb for it not to be here, eh?)  
I had some picture in between the build, but figured they were redundant as we’ve all built computers… If I find them, I will try to edit this post and put them in though. Just imagine a computer pretty much together, just lacking the CPU cooler. 
I’m just happy this computer case is large enough for me to hide most of the excess wiring behind the motherboard tray. 
Everyone does things differently, but for me I try to do things that make the most sense to me. I didn’t want to lap the CPU and possibly void the warranty, but I figured I would lap the heatsink just to try and get optimal surface contact. Here’s a shot of the “lapping table” I “built”, which was just different grits of sandpaper on my marble countertop from fine to holy cow is that sandpaper? 

The sandpaper I used:

And the last step was the polishing station I kind of rigged together with a piece of heavy quality paper, a fiber cloth under the paper, and some pretty strong masking tape to keep it all down and flat. The “polishing compound” here is some “thermal paste” that some guy at the local MicroCenter said was “the best stuff we have”. I don’t think I would use this stuff personally, it seemed a little dry and I couldn’t spread it. But I could use it as polishing compound for the CPU heatsink:

And:

In the end, after about 30 minutes of old-fashioned elbow grease, I wound up with this:

I “prepped” it for paste, because I’m the kind of guy that that puts layers of paste on his heatsink (when they’re this small) and his CPU:

And I did the same to the CPU:

And then I applied some artic-silver thermal paste I had here and removed the tape:

And:

I then placed it all back in the case, attached the heatsink to the motherboard, wriggled it around a little bit to assure the thermal paste works itself into any cracks, and firmly fastened all of the screws:

And wound up with this (Current card):

Is my cable management alright from what you can see in these pics? I tried – I think it’s a lot better than my last case, with the exception of the tray behind the motherboard (1These two pics taken before the GTX 670 was shipped back to EVGA for RMA)….

And (2These two pics taken before the GTX 670 was shipped back to EVGA for RMA):

 
So that’s my pics of the build – what do you think? Is it nice or does it need some work? I will say my hard drive config is off the charts. If anyone knows a good common HDD test utility (Maybe the Samsung magician, but I don’t know if that’s common or not), I will post the numbers on that. I have a few numbers from the Samsung Magician below.
Benchmarking:
 I can tell you right now that from the Samsung Magician, my speeds are around here for my SSD RAID0 config:
  • Sequential Read: 856 MB/s
  • Sequential Write: 853 MB/s
  • Random Read: 100,913 IOPS
  • Random Write: 111,267 IOPS
These numbers are a little less than double for the Samsung 840 PRO SSD’s numbers, by themselves without any RAID options.
My memory is the next thing I’ve been keeping an eye on. I did some Google’ing and it seems MemMaxx is a pretty popular memory benchmark utility, so that’s what I used for these screenshots (all taken at various stages throughout the OC process):
(Link to full size image: http://www.ak907.net/wp-content/uploads/2013/07/16.jpg)

I can’t get you any solid numbers from applications like CatZilla, 3DMark11, or any other benchmarking utilities because I don’t have a card that will even run these. My GTX 260 SC crashes when the phys-x test starts and 3DMark11 won’t even launch now. These applications didn’t have any issues running with the GTX 670 SC, so I can’t wait to get that back. Here’s a CPU-Z Validation (I cannot upload validation from ELeet Utility – it is wrong version per the web site when I tried to upload it):
http://valid.canardpc.com/2864080
The other cool app that I’ve been kind of benchmarking a little with, that’s more to do with CPU than anything else, is SuperPI. Here’s my numbers for SuperPI MultiCore 500,000,000 run (3 screenshots side-by-side, you may have to scroll over):
(Link to full size image: http://www.ak907.net/wp-content/uploads/2013/07/17.jpg)

Lastly, this overclock and cooler may not be a good combination, as I shut Prim95 down at 72 degrees per the motherboard temperature readout. However, this took several minutes to achieve, and I was holding steady at 65 before I started “multitasking” starting this post in the background:
(Link to full size image: http://www.ak907.net/wp-content/uploads/2013/07/18.jpg)

I’m thinking I will be getting the Corsair H110 Closed-Loop cooler in place of this Coolermaster Seidon – just from what I’ve read, the Corsair’s really are the top of the line in closed-loop coolers right now. Maybe then I can go above 4.2… I was able to get it to boot at 5.0, but that was in BIOS because I didn’t want to go all the way into Windows and chance something overheating! 65 is kind of the MAX I want to reach with this CPU, as the Tj Max is 91C.
For the most part though, this overclock is stable. I’ve been up and running for a few days now and no crashes from any kind of activity – I’m just limiting the 100% CPU usage for long durations (EG: Folding all cores). To get it up to these numbers, I adjusted the core multiplier to 42 and manually adjusted the VCore down from 1.5 (yeah, that’s where it “automatically” put it) to 1.300. I left everything else at automatic, except to adjust the memory to 1600MHz. I did not turn on XMP for this OC, but I may tinker with it.
Closing:
Well, that’s all I have for the start to what I hope is going to be a wonderful thing. I would love to have some input on this from you guys! Let me know what you think of these temp/oc numbers and the pictures – I would love to have any feedback you can offer, good or bad.
-TigerDeath
post edited by TigerDeath - 2013/07/15 08:57:23
#1

12 Replies Related Threads

    Drwheelo
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/14 16:22:30 (permalink)
    Grats on the rig man!  Too much thermal paste though.
    #2
    DrLejos
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/14 16:25:03 (permalink)
    Facepalmed so hard at use of Arctic Silver over IC Diamond. IC Diamond beats it by 3-5C on average, and is probably the best compound out there for ambient water/air. Other than that your build looks nice ^^

    I appoligize in advance if I accidentally all of your threads.
    #3
    TigerDeath
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/14 16:40:55 (permalink)
    DrLejos

    Facepalmed so hard at use of Arctic Silver over IC Diamond. IC Diamond beats it by 3-5C on average, and is probably the best compound out there for ambient water/air. Other than that your build looks nice ^^

     
    How do you spread that stuff then, or did I just get a dry tube?
    #4
    loveha
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/14 17:44:06 (permalink)
    You don't really need to spread TIM. You can let the pressure of the heatsink do the job.
    Your CPU is out of warranty now. What you did to it ruined the IHS, Intel has to be able to read the S/N that was on it. With it all scratched up like that you may as well lap that to.

    Case: Corsair 900D
    Motherboard: EVGA Z170 Classified E179
    CPU: Intel Core i7 6700K 4.6GHz
    RAM: 16GB Corsair DDR4 2133 16-15-15-36
    GPU: EVGA GTX 1070 FTW DT SLI
    PSU: EVGA 1000w G2
    SSD: Samsung 512GB 950 Pro NVME M.2
    Monitor: Acer Predator X34 100Hz G-Sync
    Sound: Schiit Modi 2 DAC~Schiit Vali 2 Amp
    Headphones: AKG K7XX Massdrop Edition

    #5
    TigerDeath
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/14 20:47:10 (permalink)
    loveha

    You don't really need to spread TIM. You can let the pressure of the heatsink do the job.
    Your CPU is out of warranty now. What you did to it ruined the IHS, Intel has to be able to read the S/N that was on it. With it all scratched up like that you may as well lap that to.

    Thanks for the info.
    I didn't do anything to the CPU, that's the way it came out of the box. That picture is VERY hard to tell, but when you see it in person there is still a legible SN on it.
     
    #6
    RainStryke
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/15 01:21:04 (permalink)
    Yeah, IC Diamond does make micro scratches in the CPU which can void your CPU warranty. I used it on my i7 950 a while back, it made a lot of micro scratches after about 3 applications... You could barely read that it was an i7 950 by the time I sold it.

    Intel i7 4790K - Corsair H90 - MSI Z87 MPOWER MAX AC - MSI GTX 980 (81.7% ASIC) - 16GB G.Skill 2400MHz - Seasonic X-1250 - Crucial MX100 512GB - Corsair Carbide 500R
     
    EVGA Affiliate Code: S27QNQME0X

    #7
    DrLejos
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/15 03:13:04 (permalink)
    You're not SUPPOSED to "spread" the thermal paste. If you read the instructions on innovationcooling.com, you would know to put a dot in the center and let the mounting pressure do the rest ^^

    I appoligize in advance if I accidentally all of your threads.
    #8
    jimrun
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/15 04:22:57 (permalink)
    ... here you go : http://www.youtube.com/watch?v=ffK7L0Qj13Q ...
     
    A few; of the many; TIMs you might want to consider : Prolimaltech PK3, Phobya HeGrease, Gelid Solutions GC-Extreme ...

      
      

     

      
      
     
    #9
    TigerDeath
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/15 07:56:02 (permalink)
    Thanks guys!
    I've watched that vid before, jimrun, and there are a few other vids on the forums here about how to spread thermal paste, along with some lengthy posts that include pictures.
    As I said above, everyone does things differently. The way I do things, may not be the way you guys do things. I'm not saying either way is "right" or "wrong". To me, it makes more sense to spread thermal paste all over the full contact surface of at least the CPU to ensure that all possible areas are covered and have thermal paste on them.
    The video that you post for example, jimrun, shows many different methods of applying thermal paste, all spread by pressure. Some of the applications work better than other, but it seems that not all of them allow the paste to spread to all corners of the CPU. While I agree that the center of the CPU is where most of the heat comes from, and that you should definitely have good contact there, I think that spreading the paste is important and allows for the paste to reach the very edges and corners of the CPU itself, allowing for more surface area, which in turns allows for better dissipation of heat.
     
    Like I said, in my head this makes the most sense. If you have paste all over your CPU and every possible "contact point" is covered it just makes sense that there are more areas and ways for heat to transfer from the CPU to the heatsink. This is how I've spread thermal paste for years (15 of them or so), and I've never had a chip fail on me yet! I haven't overclocked too terribly much in the past either, but still... :-)
     
     
    So is 1.3 a high VCore for 4.2 GHz on a 3930k or am I cooking at about the right voltage there?
    #10
    notfordman
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/15 14:24:05 (permalink)
    That is a cool build , and your having fun with it(except the rma)! That case is huge and has some neat features. I like it a lot!
    Wiring is pretty clean , I would add some sleeved extensions eventually.
    #11
    Xavier Zepherious
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/15 15:22:09 (permalink)
    I suppose a PSU upgrade will come down the line eventually
    that is if you want a tri -sli setup eventually
    ie like a 1200 watt PSU
     
    other suggestion would be to change the ram to 2133 or 2400
    (my rigs have  2133 or 2400 ram)
     
     
    I can tell you that that lapping only improves cooling slightly
    the heat drops off as you get nearer the edge of the chip - most of the heat will be directly over the cores (and mostly centered in the middle)
     
    great to do if your running a big finned cooler - because you can't increase the surface area of the cooling fins (and have limited ability to increase air movement)
    to clarify: it's directly related to the cooling pipes coming from the cpu heatsink face
    it can only dissipate heat as fast as the heat pipes can take it and send it up the pipe and as fast as the fins can draw it away from the pipes
    so it goes by how fast the heat can conduct up the pipes - and it's fixed
     
    water does not have this limitation because you can pump water in faster - pump speed  -  heat per cubic cm per min
    and cooling is directly related to rad area and fan speed and pump speed

     
     
    if you can apply faster cooling - ie - water or air movement over the core the better 
    so the more rad(more surface area) or faster the pump the better for cooling
     
    so in water cooling the more rads the better - the more air movement thru the rads the better, and the faster your water pump runs (more coolant) the better you are
     
     
    another thing to note SBE cools better than any SB or IB 2600-3770k or even 4770k(haswell) - because they are not using paste on the chip
     
     
    post edited by Xavier Zepherious - 2013/07/15 17:26:56

     
       


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    Xavier Zepherious
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    Re:Thanks EVGA - Prize Build! (BANDWIDTH WARNING!) 2013/07/15 15:56:38 (permalink)
    TigerDeath



    So is 1.3 a high VCore for 4.2 GHz on a 3930k or am I cooking at about the right voltage there?

     
    I believe you can go to around 1.44 - I think max on H2O is 1.5v...however Ive seen some higher
    the guide below states 1.5 max on H2O
    anything under 1.4 should be good
     
     
     
    http://www.overclock.net/t/1189242/sandy-bridge-e-overclocking-guide-walk-through-explanations-and-support-for-all-x79-overclockers

     
       


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