I think that was pretty much a given. What's new is that die has 12 cores. So is the 5960x based off rejected 12 core Haswell-EP chips or is that not a 5960x at all?

That's normal practice. If all 12 cores can't perform at the clocks specified or have bad sectors, some are disabled for stability. Enthusiast chips are pretty much rejected Xeons and mainstream chips are rejected mobile chips.

Still cheaper than the 12 cores that would go for 2-3k.

I take it that this CPU is now dead after they De-Lidded or is that they are looking like now.
I have De-Lidded two 3770K CPU's so that is why I ask.

Ya, that's pretty much dead. Not that the guy didn't realize this would happen, he likely has a tray at least for himself to bin.

This is kind of a "duh" since all server processors in both LGA1356 and LGA011 are also soldered, it stands to reason that with each architectural change, those markets won't be treated differently unless Intel felt certain customers required specific catering.  
 

RuffeDK
That's one step in the right direction. Now do the same with all K-series processors.

The happenstance of solder in the LGA2011 isn't a coincidence meant for high-end enthusiasts to benefit nor is it a "step in the right direction".  
 
Remember, that socket was created for the workstation/serve market, as well as LGA1356, these customers typically buy thousands and stick them in one room and worry about the costs of cooling everything, so these customers are very picky about TDP and every last micro variation in temperature.  Hence use of solder for the ported unlocked, rebranded, and core-disabled Xeon we call "Core i7" in the ported 1S workstation known as "X99".   
 
The mainstream markets in LGA115x, BGA, PGA and mPGA sockets don't care so much for such incremental temperature differences and can provide their own alternative cooling solution, so if it can save Intel money, then they will use the grease instead of solder.  All processors of a particular socket are treated the same, unlocked models are only determined at the microcode stage, not the socket stage; Intel doesn't "bin" unlocked models, they just unlocked a regular processor and charge a premium.

lehpron
This is kind of a "duh" since all server processors in both LGA1356 and LGA011 are also soldered, it stands to reason that with each architectural change, those markets won't be treated differently unless Intel felt certain customers required specific catering.  
 

RuffeDK
That's one step in the right direction. Now do the same with all K-series processors.

The happenstance of solder in the LGA2011 isn't a coincidence meant for high-end enthusiasts to benefit nor is it a "step in the right direction".  
 
Remember, that socket was created for the workstation/serve market, as well as LGA1356, these customers typically buy thousands and stick them in one room and worry about the costs of cooling everything, so these customers are very picky about TDP and every last micro variation in temperature.  Hence use of solder for the ported unlocked, rebranded, and core-disabled Xeon we call "Core i7" in the ported 1S workstation known as "X99".   
 
The mainstream markets in LGA115x, BGA, PGA and mPGA sockets don't care so much for such incremental temperature differences and can provide their own alternative cooling solution, so if it can save Intel money, then they will use the grease instead of solder.  All processors of a particular socket are treated the same, unlocked models are only determined at the microcode stage, not the socket stage; Intel doesn't "bin" unlocked models, they just unlocked a regular processor and charge a premium.

For my usage one more upgrade and I'll be out of my mind.