Getting ready to build my 4790K system and going to be re-using my Noctua D14 from my Lynnfield.  Last time I changed my thermal paste was about 3 years ago with some Arctic MX-3.  Is that still a decent compound?  If it's been sealed up good and stored in decent temps should it also still be good to use or do I need a new tube of something?  

It is cheap enough to get a new tube and not run the risk of needing to find it last second.

Sorry I should have been a little more specific.  I know for overclocking,  delidding,  etc I will need better.  I was talking more about stock out of the box for the moment. 

flyinion
Sorry I should have been a little more specific.  I know for overclocking,  delidding,  etc I will need better.  I was talking more about stock out of the box for the moment. 

Run it
 
My AS5 over 6 years old works great.

Is the liquid metal stuff only useful for between the die and heatspreader?  I'm wondering how thick a layer would have to be used.  I thought I understood Intel went away from soldering the heatspreader because there was an increase in the gap or something.  Obviously I can't just pile it on, put the spreader back on, and mount the chip in my board and turn it up on its side due to being mounted in a tower since then I'd have conductive heatsink compound running off the die and straight into the caps that are under the spreader as well.

outhouse

flyinion
Is the liquid metal stuff only useful for between the die and heatspreader?  I'm wondering how thick a layer would have to be used.  I thought I understood Intel went away from soldering the heatspreader because there was an increase in the gap or something.  Obviously I can't just pile it on, put the spreader back on, and mount the chip in my board and turn it up on its side due to being mounted in a tower since then I'd have conductive heatsink compound running off the die and straight into the caps that are under the spreader as well.

Regular TIM will not help for delidding, ive done two no, and not a single C change. There stock TIM is decent.
 
Yes only use the CLU or CLP in the die itself.   And that is only after you use nail polish in the resistors/caps.
 
Using CLU/P on the IHS and waterblock may only save you a C or two.  The die is the critical area that really needs the better TIM.

Ah ok that makes sense (coating the caps/etc.).  Quick question on your system in your signature.......is that a 4.8 overclock with all cores + HT?  Also is that what you were talking about getting up to 75C on while gaming?  Or was that at stock non-OC that you got that?

flyinion

outhouse

flyinion
Is the liquid metal stuff only useful for between the die and heatspreader?  I'm wondering how thick a layer would have to be used.  I thought I understood Intel went away from soldering the heatspreader because there was an increase in the gap or something.  Obviously I can't just pile it on, put the spreader back on, and mount the chip in my board and turn it up on its side due to being mounted in a tower since then I'd have conductive heatsink compound running off the die and straight into the caps that are under the spreader as well.

Regular TIM will not help for delidding, ive done two no, and not a single C change. There stock TIM is decent.
 
Yes only use the CLU or CLP in the die itself.   And that is only after you use nail polish in the resistors/caps.
 
Using CLU/P on the IHS and waterblock may only save you a C or two.  The die is the critical area that really needs the better TIM.

Ah ok that makes sense (coating the caps/etc.).  Quick question on your system in your signature.......is that a 4.8 overclock with all cores + HT?  Also is that what you were talking about getting up to 75C on while gaming?  Or was that at stock non-OC that you got that?

Yes all cores at 4.8 plus HT 1.325v
 
Yes last night high 70's and lost stability.  Had my first BS.   My 5 rad fans were all turned down to 60% .  Upped the fans to 100% and reianed stability.
 
Even at 1.25v, with the latest prime95 im over 90C on small's 

Thanks again guys.  Yeah I will probably OC once I know the system is stable and have all my games tuned on graphics settings and stuff.  For the moment I just want to make sure what I have works fine for stock.  I can deal with whatever TIM, delidding, etc. is needed later on.  I just didn't want to put it all together and find out MX-3 is junk now and I'm getting 60C at idle at stock speeds or something silly like that.

outhouse

flyinion
 I'm getting 60C at idle at stock speeds .

Wow, you have issues. 
 
When that happens it s usually the block not hitting the IHS correctly.

LOL I think you read my post too quickly.  I said I didn't want to put everything together and end up with something like that because MX-3 is junk now or something.  I don't even have all my parts yet to build the system lol.  I'm hopefully getting the CPU tonight.  An old Intel co-worker ordered it through their employee purchase program for me.  4790K for about $180