First and foremostx tbe misconception that more power phases spreads out the power and runs cooler has never been true. It doesnt work like that at all. With less phases, the mosfets are much further apart, so the influence from one to another is reduced. Cram 13 side by side, or 10 for the ftw, and the influence is increased.
The thermal pad modification is said to be optional. If you dont want to install it, you dont have to.
Removing a small piece of the thermal pad for the backplate will not hurt anything. You can easily do that and still install it.
For the vrm section being completely different, that is normal, but i have not seen the classified pcb in person. The classified typically uses completely different mosfets and chokes since it is 100% meant for exotic cooling measures. The mosfets are still in the same location and would still have a thermal pad across them. The FTW even has a thermal pad across the mosfets, but most people assume it doesn't because the internet said somewhere that it was missing, although that is wrong.
The thermal pad that EVGA supplied would go above the original thermal pad on the other side of the heat spreader and theoretically transfer heat from the heat spreader to the cooler.
The instructions tell you how to install them on the classified. If you are going to install the thermal pads, follow the instructions in the thermal pad modification thread that is stickied to the top of the forum.
post edited by Scarlet-Tech - 2016/11/20 19:03:07